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Measurement of Thin Film Mechanical Properties by Microbeam Bending

Published online by Cambridge University Press:  10 February 2011

J. Florando ,
H. Fujimoto ,
Q. Ma ,
O. Kraft ,
R. Schwaiger  and
W. D. Nix
J. Florando
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA 94305
H. Fujimoto
Affiliation:
Components Research, Intel Corp. SC1-03, 2200 Misson Collge Blvd. Santa Clara, CA, 95052
Q. Ma
Affiliation:
Components Research, Intel Corp. SC1-03, 2200 Misson Collge Blvd. Santa Clara, CA, 95052
O. Kraft
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, GERMANY
R. Schwaiger
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, GERMANY
W. D. Nix
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

An improved microbeam bending technique has been developed for the study of mechanical properties of thin films on substrates. This testing method utilizes a triangular beam geometry and improved micromachining techniques compared to previously used methods. The technique permits the stress-strain law for a metal film on a substrate to be determined. Single crystal Si beams and bi-layer Si/Al beams of lengths 25–100 pgm have been fabricated and tested. The beams are deflected with a nanoindenter, which accurately imposes a load on the beam and measures the corresponding displacement. For the bi-layer beams, a simple numerical model utilizing a Ramburg-Osgood constitutive law the film has been developed to determine the stress-strain behavior of the Al film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 563: Symposium M – Materials Reliability in Microelectronics IX , 1999 , 231
Copyright
Copyright © Materials Research Society 1999

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References

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