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Measurement of Thin Film Mechanical Properties by Microbeam Bending

Published online by Cambridge University Press:  10 February 2011

J. Florando ,
H. Fujimoto ,
Q. Ma ,
O. Kraft ,
R. Schwaiger  and
W. D. Nix
J. Florando
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA 94305
H. Fujimoto
Affiliation:
Components Research, Intel Corp. SC1-03, 2200 Misson Collge Blvd. Santa Clara, CA, 95052
Q. Ma
Affiliation:
Components Research, Intel Corp. SC1-03, 2200 Misson Collge Blvd. Santa Clara, CA, 95052
O. Kraft
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, GERMANY
R. Schwaiger
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, GERMANY
W. D. Nix
Affiliation:
Dept. of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

An improved microbeam bending technique has been developed for the study of mechanical properties of thin films on substrates. This testing method utilizes a triangular beam geometry and improved micromachining techniques compared to previously used methods. The technique permits the stress-strain law for a metal film on a substrate to be determined. Single crystal Si beams and bi-layer Si/Al beams of lengths 25–100 pgm have been fabricated and tested. The beams are deflected with a nanoindenter, which accurately imposes a load on the beam and measures the corresponding displacement. For the bi-layer beams, a simple numerical model utilizing a Ramburg-Osgood constitutive law the film has been developed to determine the stress-strain behavior of the Al film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 563: Symposium M – Materials Reliability in Microelectronics IX , 1999 , 231
Copyright
Copyright © Materials Research Society 1999

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References

1. Nix, W.D., “Mechanical Properties of Thin Films”, Metall. Trans. A, 20A, 2217 (1989).Google Scholar
2. Vlassak, J.J. and Nix, W.D., J. Materials Research, 7, 3242 (1992).Google Scholar
3. Weihs, T.P., Hong, S., Bravman, J.C. and Nix, W.D., J. Materials Research, 3, 931 (1988).Google Scholar
4. Weihs, T.P., Hong, S., Bravman, J.C. and Nix, W.D., Mat. Research Symposium Proc., 130, 87 (1989).Google Scholar
5. Hong, S., Weihs, T.P., Bravman, J.C. and Nix, W.D., Mat. Research Symposium Proc., 130, 93 (1989).Google Scholar
6. Baker, S.P. and Nix, W.D., Journal of Materials Research, 66 3131 (1994).Google Scholar
7. Keller, R.M., Bader, S., Vinci, R.P.. and Arzt, E., Mat. Research Symposium Proc., 365, 453 (1995).Google Scholar