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Measurement of the Triaxial Stress State of Confined Line Structures During Thermal Cycling

Published online by Cambridge University Press:  25 February 2011

M.A. Moske ,
P.S. Ho ,
D.J. Mikalsen ,
J.J. Cuomo  and
R. Rosenberg
M.A. Moske
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
P.S. Ho
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
D.J. Mikalsen
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
J.J. Cuomo
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
R. Rosenberg
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

A method based on the bending beam technique has been developed to measure the mechanical stresses of fine lines confined by a dielectric layer. This method has been employed to determine the thermal stress of AI(2at%Cu) lines passivated by a quartz overlayer between room temperature and 400ºC. The effect of quartz confinement was analyzed by matching the thermal strains at the metal/quartz interfaces and imposing a mechanical equilibrium condition on the structure. The analysis enables us to deduce the triaxial stress components of metal and quartz from measurements of the substrate bending parallel and perpendicular to the length direction of the lines. Results of the measurementshow a substantial stress enhancement as a result of the confinement, with the stress level significantly higher than that of a passivatecd blanket film. The magnitude of the stress depends on the line geometry, the layer deposition conditions and the extent of plastic deformation during thermal cycling. Results of this measurement are consistent with those determined using X-ray techniques.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 77
Copyright
Copyright © Materials Research Society 1991

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References

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