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Measurement of Mechanical Bulk- and Interfaceproperties of Thin Polymeric Films

Published online by Cambridge University Press:  25 February 2011

Kyung-Suk Kim
Kyung-Suk Kim*
Affiliation:
Division of EngineeringBrown UniversityProvidence, RI 02912
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Abstract

Theoretical and experimental studies on the measurement of the mechanical constitutive relation and the interfacial strength for thin polymeric film structures are presented. For the measurement of the constitutive relation, a new innovative testing technique based on the J-integral concept is introduced. This method measures the stressstrain relationship in the thickness direction, while the stress-strain relationship in the lateral direction can be measured with conventional techniques. For the measurement of interface strength the cut test and the ball rolling test were used to construct the failure criteria, based on the interface fracture mechanics concept. The interface between polyimide and glass (SiO2) has been tested and analyzed in detail. This shows that the toughness of the PMDA-ODA polyimide/glass interface was measured as 2.2 J/m2 in pure opening mode and as 15 J/m2 for pure sliding mode. It was also observed that the PMDA-ODA/SiO2 interface toughness is insensitive to temperature variations in the range of 20ºC — 250ºC.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 3
Copyright
Copyright © Materials Research Society 1991

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References

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