Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-29T07:26:51.544Z Has data issue: false hasContentIssue false
  • English
  • Français

Materials Surface Processing with Excimer Lasers

Published online by Cambridge University Press:  25 February 2011

David J. Elliott  and
Bernhard P. Piwczyk
David J. Elliott
Affiliation:
LEITZ-IMAGE MICRO SYSTEMS CO. 900 Middlesex Turnpike, Building #8 Billerica, MA 01821
Bernhard P. Piwczyk
Affiliation:
LEITZ-IMAGE MICRO SYSTEMS CO. 900 Middlesex Turnpike, Building #8 Billerica, MA 01821
Get access

Abstract

The continued reduction of VLSI circuit geometries together with increasingly higher levels of circuit integration create the demand for new circuit fabrication technologies. One of the limitations of current IC fabrication technology is the use of high temperature processing. High temperatures severely distort silicon wafers, causing loss of geometry control and a subsequent reduction of device yield. Excimer laser technology, at very short ultra-violet wavelengths offers the possibility of extremely low temperature processing, including the following major applications: Photoresist exposure, photoresist ablation over alignment marks, annealing and etching. In addition, applications in circuit personalization and fiber optics appear as very promising new applications for excimer laser technology in the electronics industry.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 76: Symposium C – Science and Technology of Microfabrication , 1986 , 295
Copyright
Copyright © Materials Research Society 1987

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Egger, H., Pummer, H., and Rhodes, C.K., EXCIMER LASERS FOR THE GENERATION OF EXTREME ULTRA-VIOLET RADIATION, Laser Focus, June, 1982.Google Scholar
2. Pummer, H., THE STATUS OF COMMERCIAL EXCIMER LASER DEVELOPMENT, Lambda Physik, 289 Great Road, Acton, MA, July, 1985 Google Scholar
3. Jain, K., Willson, C.G., Lin, B.J., ULTRAFAST HIGH-RESOLUTION CONTACT LITHOGRAPHY WITH EXCIMER LASERS, IBM J. Res. Develop. Vol.26, No. 2, March, 1982.Google Scholar
4. Jain, K., SHORT WAVELENGTH LASERS ARE HELPING FABRICATE EVER-SMALLER DEVICES, Laser Applications in Semiconductor Microlithography, Lasers and Applications, Sept. 1983.Google Scholar
5. Srinivasan and Bodil Braren, R., ABLATIVE PHOTODECOMPOSITION OF POLYMER FILMS BY PULSED FAR-ULTRA-VIOLET (193NM) LASER RADIATION; DEPENDENCE OF ETCH DEPTH ON EXPERIMENTAL CONDITIONS, Journal of Polymer Science: Polymer Chemistry Edition, Vol.22, 2601–2609 (1984), John Wiley & Sons, Inc.Google Scholar
6. Garrison, B., Srinivasan, R., LASER ABLATION OF ORGANIC POLYMERS: MICROSCOPIC MODELS FOR PHOTOCHEMICAL AND THERMAL PROCESSES, J. Appl. Phys. 57 (8), 15 April, 1985.Google Scholar
7. Ehrlich, D.J., EARLY APPLICATIONS OF LASER DIRECT PATTERNING: DIRECT WRITING AND EXCIMER PROJECTION, Solid State Technology, December, 1985.Google Scholar
8. Alspector, Joshua, Lee, Charles and Contolini, Robert, A LASER PROGRAMMABLE CMOS ARRAY FOR RANDOM LOGIC DESIGN, Bell Communications Research, 435 South Street, Morristown, NJ 07960Google Scholar
9. Srinivasan, R., ACTION OF FAR-ULTRA-VIOLET LIGHT ON ORGANIC POLYMER FILMS: APPLICATIONS TO SEMICONDUCTOR TECHNOLOGY, IBM Thomas J. Watson Research Center, Yorktown Heights, NY.Google Scholar