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Materials Issues In X-Ray Lithography

Published online by Cambridge University Press:  15 February 2011

E.A. Dobisz
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
M. C. Peckerar
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
W. Chut
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
K. Rheet
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
L. S. Shirey
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
C. R. K. Marrian
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
R. E. Salvino
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
K. Foster
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
J. Kosokowski
Affiliation:
U.S. Naval Research Laboratory Electronics Science And Technology Division Washington D.C., 20375
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Abstract

In this paper, an outline of materials-related activities in the national X-Ray Lithography Program is given. The program is directed towards the development of sub-quarter micron design-rule x-ray lithography together with the ancillary technologies required to fabricate defect-free x-ray masks. Work done at the Naval Research Laboratory is highlighted and used for examples. Most materials related work occurs in conjunction in the x-ray mask fabrication pro. cess. Topics discussed include electron beam-matter interaction in the mask patterning process, membane fabrication, stress control in thin membranes, reactive-ion etching of absorber-layers, mask inspection and repair.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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