Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-23T10:52:59.305Z Has data issue: false hasContentIssue false
  • English
  • Français

Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints

Published online by Cambridge University Press:  26 February 2011

Su-Chun Yang ,
Cheng-En Ho ,
Chien-Wei Chang  and
C Robert Kao
Su-Chun Yang
Affiliation:
[email protected], National Taiwan University, Department of Materials Science and Engineering, No. 1, Sec. 4, Roosevelt Road,, Taipei, 10617, Taiwan
Cheng-En Ho
Affiliation:
[email protected], National Central University, Department of Chemical and Materials Engineering, No.300, Jhongda Rd.,, Jhongli City, 32001, Taiwan
Chien-Wei Chang
Affiliation:
[email protected], National Central University, Department of Chemical and Materials Engineering, No.300, Jhongda Rd.,, Jhongli City, 32001, Taiwan
C Robert Kao
Affiliation:
[email protected], National Taiwan University, Department of Materials Science and Engineering, No. 1, Sec. 4, Roosevelt Road,, Taipei, 10617, Taiwan
Get access

Abstract

Spalling of intermetallic compounds in a massive scale has been reported in the literature for several solder/substrate systems, including SnAgCu soldered on Ni substrate, SnZn on Cu, high-Pb PbSn on Cu, and high-Pb PbSn on Ni. In this work, a common mechanism based on thermodynamic arguments is proposed to explain this rather peculiar phenomenon that occurs across several systems. According to this mechanism, two necessary conditions must be met. This first is that the most reactive element must be present in a limited amount, and the second is that the soldering reaction must be very sensitive to the concentration of this element. With the growth of intermetallic, more and more of the most reactive elements are extracted out of the solder and incorporated into intermetallic. As the concentration of this element decreases, the local equilibrium phase at the interface changes. This changing of the equilibrium phases caused the non-equilibrium phase to spall.

Keywords

solderingdiffusionsurface reaction
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V03-01
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tu, K. N. and Zeng, K., Mater. Sci. Eng. R, 34, 1 (2001).Google Scholar
2. Pan, G. Z., Liu, A. A., Kim, H. K., Tu, K. N., and Totta, P. A., Appl. Phys. Lett., 71, 2946 (1997).Google Scholar
3. Ho, C. E., Lin, Y. W., Yang, S. C., Kao, C. R., and Jiang, D. S., J. Electron. Mater., 35, 1017 (2006).Google Scholar
4. Ho, C. E., Yang, S. C., and Kao, C. R., J Mater Sci-Mater El (2006) (in press).Google Scholar
5. JEITA (Japan Electronics and Information Technology Industries Association) Lead-Free Roadmap Project, October 2002.Google Scholar
6. Workshop on Modeling and Data Needs for Lead-Free Solders (Meeting Report presented at the National Electronics Manufacturing Initiative, New Orleans, LA, 15 February 2001).Google Scholar
7. IDEALS-Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering. Brite-Euram Contact BRPR-CT96-0140. Project number BE95-1994. May 1st 1996 to April 30th 1999.Google Scholar
8. Ho, C. E., Lin, Y. L., and Kao, C. R., Chem. Mater., 14, 949 (2002).Google Scholar
9. Chen, W. T., Ho, C. E., and Kao, C. R., J. Mater. Res., 17, 263 (2002).Google Scholar
10. Ho, C. E., Tsai, R. Y., Lin, Y. L., and Kao, C. R., J. Electron. Mater., 31, 584 (2002).Google Scholar
11. Zeng, K., Vuorinen, V., and Kivilahti, J. K., IEEE Trans. Electron. Packag. Manufact., 25, 162 (2002).Google Scholar
12. Laurila, T., Vuorinen, V., and Kivilahti, J. K., Mater. Sci. Eng., R49, 1 (2005).Google Scholar
13. Zeng, K. and Tu, K. N., Mater. Sci. Eng. R, 38, 55 (2002).Google Scholar
14. Massalski, T. B. (ed.), in “Binary Alloy Phase Diagrams” (ASM International, Metal Park, OH, 1990) p.1481.Google Scholar
15. Nash, P. and Nash, A., Bull. Alloy Phase Diag., 6, 350 (1985).10.1007/BF02880521Google Scholar
16. Yang, S. C., Ho, C. E., Chang, C. W., and Kao, C. R., J. Mater. Res., 21, 1 (2006).Google Scholar
17. Chou, C. Y. and Chen, S. W., Acta Mater., 54, 2393 (2006).Google Scholar
18. Kang, S. K., Shih, D. Y., Leonard, D., Henderson, D. W., Gosselin, T., Cho, S., Yu, J., and Choi, W. K., JOM, 56, 34 (2004).Google Scholar
19. Jang, J. W., Ramanathan, L. N., Lin, J. K., and Frear, D. R., J. Appl. Phys., 95, 8286 (2004).Google Scholar
20. Ramanathan, L. N., Jang, J. W., Lin, J. K., and Frear, D. R., J. Electron. Mater., 34, L43 (2005).10.1007/s11664-005-0262-7Google Scholar
21. Jang, J. W., Kim, P. G., Tu, K. N., and Lee, M., J. Mater. Res., 14, 3895 (1999).10.1557/JMR.1999.0527Google Scholar
22. Wang, K. Z. and Chen, C. M., J. Electron. Mater., 34, 1543 (2005).Google Scholar