Hostname: page-component-cd9895bd7-q99xh Total loading time: 0 Render date: 2024-12-27T02:26:39.698Z Has data issue: false hasContentIssue false
  • English
  • Français

Low-Temperature Hetero-Epitaxial Growth of Ge on Si by High Density Plasma Chemical Vapor Deposition

Published online by Cambridge University Press:  01 February 2011

Malcolm Carroll ,
Josephine Sheng  and
Jason C. Verley
Malcolm Carroll
Affiliation:
[email protected], Sandia National Laboratories, Photonic Microsystems Technology, P.O. Box 5800, M.S. 1082, Albuquerque, NM, 87185, United States, 505 284 3499
Josephine Sheng
Affiliation:
[email protected], Sandia National Laboratories, Albuquerque, NM, 87185, United States
Jason C. Verley
Affiliation:
[email protected], Sandia National Laboratories, Albuquerque, NM, 87185, United States
Get access

Abstract

Demand for integration of optoelectronic functionality (e.g., optical interconnects) with silicon complementary metal oxide semiconductor (CMOS) technology has for many years motivated the investigation of low temperature (∼ 450°C) germanium deposition processes that may be integrated in to the back-end CMOS process flow. A common challenge to improving the germanium quality is the thermal budget of the in-situ bake, which is used to reduce defect forming oxygen and carbon surface residues. Typical cleaning temperatures to remove significant concentrations of oxygen and carbon have been reported to be approximately 750°C for thermal hydrogen bakes in standard chemical vapor deposition chambers. Germanium device performance using lower peak in-situ cleans (i.e., ∼450°C) has been hampered by additional crystal defectivity, although epitaxy is possible with out complete removal of oxygen and carbon at lower temperatures.

Plasma enhanced chemical vapor deposition (PECVD) is used to reduce the processing temperature. Hydrogen plasma assisted in-situ surface preparation of epitaxy has been shown to reduce both carbon and oxygen concentrations and enable epitaxial growth at temperatures as low as ∼150°C. The hydrogen is believed to help produce volatile Si-O and H2O species in the removal of oxygen, although typically this is not reported to occur rapidly enough to completely clear the surface of all oxygen until ∼550°C. In this paper, we describe the use of an in-situ argon/germane high density plasma to help initiate germanium epitaxy on silicon using a peak temperature of approximately 460°C. Germanium is believed to readily break Si-O bonds to form more volatile Ge-O, therefore, argon/germane plasmas offer the potential to reduce the necessary in-situ clean temperature while obtaining similar results as hydrogen in-situ cleans. To the authors knowledge this report is also the first demonstration of germanium epitaxy on silicon using this commercially available high density plasma chamber configuration instead of, for example, remote or electron cyclotron resonance configurations.

Keywords

Geepitaxyplasma-enhanced CVD (PECVD) (deposition)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 934: Symposium I – Silicon-Based Microphotonics , 2006 , 0934-I09-02
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Oda, K. and Kiyota, Y., J. Electrochem. Soc., vol. 143, pp. 2361, 1996.Google Scholar
[2] Carroll, M. S. and King, C. A., Thin Solid Films, vol. 473, pp. 137, 2003.Google Scholar
[3] Crossley, A., et al., Vacuum, vol. 46, pp. 667, 1995.Google Scholar
[4] Bandaru, P. R., et al. Material Science and Engineering B, vol. 113, pp. 79–84, 2004.Google Scholar
[5] Kim, H.-W. and Reif, R., Thin Solid FIlms, vol. 289, pp. 192–198, 1996.Google Scholar
[6] Tae, H.-S., et al. Applied Physics Letters, vol. 64, pp. 1021, 1993.Google Scholar
[7] Wang, C.-L., et al. J. Electrochem. Soc., vol. 143, pp. 2387, 1996.Google Scholar
[8] Morar, J. F., et al. Appl. Phys. Lett., vol. 50, pp. 463, 1986.Google Scholar
[9] Moslehi, M. M., SPIE - Rapid Thermal and Related Processing Techniques, vol. 1393, pp. 90, 1990.Google Scholar
[10] Kuo, Y.-H., et al. Nature, vol. 437, pp. 1334, 2005.Google Scholar
[11] Liu, J., et al. Applied Physics Letters, vol. 87, pp. 103501, 2005.Google Scholar
[12] Masini, G., et al., Applied Physics Letters, vol. 80, pp. 3268, 2002.Google Scholar
[13] Applied-Materials, High Density Plasma Chemical Vapor Deposition Chamber (Centura)Google Scholar
[14] Csepregi, L., et al., Solid State Communications, vol. 21, pp. 1019–1021, 1977.Google Scholar
[15] Reidy, S., et al., J. of Vac. Sci. Tech. B, vol. 21, pp. 970, 2003.Google Scholar
[16] Kim, H.-W., Materials Science and Engineering. Ph.D. Thesis, Massachusetts Institute of Technology, 1994.Google Scholar
[17] Li, Q., et al., Applied Physics Letters, vol. 83, pp. 5032, 2003.Google Scholar