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Low-Defect-Density Ge on Si for Large-Lattice-Mismatched Semiconductor Integration and Strain-Engineered Devices
Published online by Cambridge University Press: 25 February 2011
Abstract
Heteroepitaxial Ge layers were grown on vicinal Si(100) by molecular beam epitaxy (MBE) at substrate temperatures of 500°C and 900°C. The layers grown at 500°C were topographically smooth with planar interfaces and a typically high threading dislocation density at the surface (> 108cm−2). Layers grown at 900°C (nucleation at 500°C) showed smooth topography, an interface highly facetted on (111) planes and a dense network of dislocations that is well confined to the interfacial region. Etch pit density measurements indicated that defect densities at the surface were as low as 1 × 105cm−2. Biaxial tensile strains of 1.2 × l0−3 and 2.5 × l0−3 were measured by Raman spectroscopy for the 500°C and 900°C layers, respectively. RBS/channeling spectra supported crosssection TEM results indicating interfacial defect confinement in the layers grown at 900°C. A model describing thermal radiation absorption suggests that interfacial Ge melting occurred during the high temperature growths.
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- Copyright © Materials Research Society 1992
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