Hostname: page-component-78c5997874-m6dg7 Total loading time: 0 Render date: 2024-11-03T05:40:48.112Z Has data issue: false hasContentIssue false
  • English
  • Français

Low Dielectric Constant Laminates Containing Microspheres

Published online by Cambridge University Press:  15 February 2011

Robert M. Japp  and
Kostas I. Papathomas
Robert M. Japp
Affiliation:
IBM Microelectronics, Endicott, NY 13760
Kostas I. Papathomas
Affiliation:
IBM Microelectronics, Endicott, NY 13760
Get access

Abstract

As electronic devices become faster, the effective dielectric constant of the circuit packaging connecting them becomes more important. The dielectric constant of standard epoxy/glass laminates can be significantly reduced by the addition of hollow glass microspheres. However the addition of such microspheres usually results in the degradation of other physical, electrical and mechanical properties which are prerequisites for materials to be used in commercial circuit packaging. By carefully optimizing the formulation many of these undesirable effects can be avoided. These topics and others pertaining to the development and testing of a microsphere laminate are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 372: Symposium W1 – Hollow and Solid Spheres and Microspheres--Science and Technology , 1994 , 221
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Haining, F. W. and Herbaugh, D. G., IBM Technical Disclosure Bulletin, Vol. 22, No. 5, (1979).Google Scholar
2. Veatch, F., Alford, H. E., Croft, R. D., U.S. Patent No. 2,978,339, (1961).Google Scholar
3. Chellis, L. N., Japp, R. M., Summa, W.J., Rudik, W. J., Wang, D. W., U.S. Patent No. 5,126,192, (1992).Google Scholar
4. Liu, P. C., Wang, D. W., Livingston, E. D., Chen, W. T., “Moisture Absorption Behavior of Printed Circuit Laminate Materials”, Advances in Electronic packaging, ASME, EEP, Vol.4–1, (1993).Google Scholar
5. Gotro, J. T., Japp, R. M. and Lewis, T. L., in “A New Multifunctional High Performance Epoxy Resin For MCM-L Applications”, 1PC Proc. Fall (1993).Google Scholar