Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-25T15:41:02.805Z Has data issue: false hasContentIssue false

Localized Laser-Assisted Deposition of Silicon,Silicon Nitride and Silicon Dioxide

Published online by Cambridge University Press:  26 February 2011

Geoffrey Auvert
Affiliation:
Centre National d'etudes des Telecommunications B.P.98, 38243 Meylan, France.
Yves Pauleau
Affiliation:
Centre National d'etudes des Telecommunications B.P.98, 38243 Meylan, France.
Didier Tonneau
Affiliation:
Centre National d'etudes des Telecommunications B.P.98, 38243 Meylan, France.
Get access

Abstract

The localized laser-induced deposition of an insulator for silicon-based microelectronics seems to be an unsolved problem. In order to understand the limiting mechanism in the deposition, the formation kinetics of silicon, silicon oxide and silicon nitride using various laser wavelengths and gas mixtures have been studied Depending upon wavelength and laser-induced temperature, various chemical reactions are involved. In the presence of ammonia, the growth rate of silicon nitride dots was found to be lower than the corresponding silicon deposition rate, indicating that deposition starts with silane decomposition followed by nitridation of silicon. By evaluating the influence of the wavelengths, the existence of a photolytic aided reaction is detected in the presence of 2.4 eV photons. In the presence of oxygen molecules and under most experimental conditions, no deposition occurs. The formation of volatile intermediate compounds can explain the difficulty of locally depositing silicon dioxide.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Allen, S.D., IEEE Circuits and Devices Mag. V. 2, N.1,(1987), p.32.Google Scholar
2 Ehrlich, D.J. and Tsao, J.Y. Appl. Phys. Lett. 44 (1985),p.267.Google Scholar
3 Szikora, S., Krauter, W. and Bauerle, D., Mater. Lett. V.2,4A,(1984),p.263.Google Scholar
4 Auvert, G., Tonneau, D. and Pauleau, Y., Eur. Mat. Res. Soc. Symp., in “Laser Processing and Diagnostics”, Eds. Bauerle, D., Kompa, K.L. and Laude, L., Les Editions de Physique, Strasbourg, France, (1986),p. 109.Google Scholar
5 Tonneau, D., Auvert, G. and Pauleau, Y., in “Laser Welding, Machining and Materials Processing”, ICALEO'85 Proceedings, Ed. Albright, C., IFS Ltd and Springer Verlag,New York, (1986) p.221.Google Scholar
6 Tonneau, D., Auvert, G. and Pauleau, Y., Thin Solid Films, V.155 (1987), p.75.Google Scholar
7 Tonneau, D. and Auvert, G., Eur. Mat. Res. Soc. Symp., in “Photon, Beam and Plasma Enhanced Processing” Ed. Nguyen, V.T., Krimmel, E.F., Golanski, A., Les Editions de Physique, Paris, (1987), (in press).Google Scholar
8 Tonneau, D. and Auvert, G., Mat. Res. Soc. Proc, (1987),this proceeding.Google Scholar
9 Bosch, M.A. and Lemons, R.A., Phys. Rev. Lett., 47, (1981),p.1151.Google Scholar