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Laser-Chemical 3-D Micromachining

Published online by Cambridge University Press:  22 February 2011

T. M. Bloomstein  and
D. J. Ehrlich
T. M. Bloomstein
Affiliation:
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–9108
D. J. Ehrlich
Affiliation:
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–9108
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Abstract

Three-dimensional parts are machined in silicon using laser-induced chlorine etching reactions. Structures are created directly from solid-modeling computer-aided-design/computer-aided-manufacturing software. Removal rates exceeding 2×104 and 105μm3/s, several orders of magnitude faster than electrodischarge machining methods, are achieved at 1-μm, and 15-μm x-y resolution, respectively. Laser-induced metallization of resulting structures as well as replication through compression molding have been demonstrated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 282: Symposium E – Chemical Perspectives of Microelectronic Materials III , 1992 , 165
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1. See, for example, Laser Microfabrication: Thin Film Processes and Lithography, edited by Ehrlich, D. J. and Tsao, J. Y. (Academic, Boston, 1989).Google Scholar
2. Bloomstein, T. M. and Ehrlich, D. J., in Proceedings of MEMS “91 (IEEE, New York, 1991), pp. 202–203;Google Scholar
Bloomstein, T. M. and Ehrlich, D. J., Appl. Phys. Lett. 61, 708 (1992).Google Scholar
3. Ehrfeld, W., Götze, F., Münchmeyer, D., Schelb, W., and Schmidt, D., in Technical Digest of the Solid-State Sensor and Acutator Workshop (IEEE, New York, 1988), pp. 1–4;Google Scholar
Guckel, H., Christenson, T.R., Skrobis, K.J., Denton, D.D., Choi, B., Lovell, E.G., Lee, J. W., Bajikar, S.S., and Chapman, T. W., in Technical Digest of the Solid-State Sensor and Actuator Workshop (IEEE, New York, 1990), pp. 118–122.Google Scholar
4. see Ashby, C. I. H. and Tsao, J. Y., Ref. 1, pp. 268–271.Google Scholar
5. See, for example, Muraski, S. J., Mach. Des. 62, 127 (1990).Google Scholar
6. see Ritsko, J., Ref. 1, pp. 333–344.Google Scholar
7. Loney, G. C., Proc. SPIE 1454, 198 (1991).Google Scholar
8. see Zeiger, H. J., Ehrlich, D. J., and Tsao, J. Y., Ref. 1, pp. 285–330. Note that a misprint exists in Fig. 5.4 of this reference; the horizontal axis should read: lOO× shorter times.Google Scholar
9. Ehrlich, D. J. and Tsao, J. Y., Appl. Phys. Lett. 44, 267 (1984).Google Scholar