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Laser Surface Modification for Copper Deposition on Polyimide

Published online by Cambridge University Press:  25 February 2011

Y.S. Liu  and
H.S. Cole
Y.S. Liu
Affiliation:
GE Research and Development Center P.O. Box 8, Schenectady, New York 12345
H.S. Cole
Affiliation:
GE Research and Development Center P.O. Box 8, Schenectady, New York 12345
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Abstract

Selective modification of surface reactivities with lasers, using either direct writing or projection method, is intrinsically a sensitive method to prepare a surface for highresolution and high-speed area selective thin film deposition. In this paper, we demonstrated the use of laser direct-writing and projection patterning techniques for selective modification of the electrochemical property of a polyimide surface. High quality and highresolution copper patterns on polyimide surfaces are produced when the surface-modified sample is subsequently placed in an electroless plating solution. These results demonstrated that the use of laser-selective-modification of surface properties in conjunction with other batch thin film deposition processes provides an attractive approach for area-selective metallization for a variety of applications in which high writing speed and high sensitivity are required.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 129: Symposium B – Laser and Particle-Beam Modification of Chemical Processes on Surfaces , 1988 , 579
Copyright
Copyright © Materials Research Society 1989

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References

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