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Laser Induced Metal Deposition on Semiconductor, Metallic and Polymeric Substrates From Electroplating Solutions

Published online by Cambridge University Press:  26 February 2011

J. Zahavi
Affiliation:
Israel Institute of Metals, Technion City, Haifa 32000, Israel
S. Tamir
Affiliation:
Israel Institute of Metals, Technion City, Haifa 32000, Israel
M. Rotel
Affiliation:
Israel Institute of Metals, Technion City, Haifa 32000, Israel
G.J. Campisi
Affiliation:
Electronic Technology Division, Naval Research Lab., Washington, D.C. 20375-5000, U.S.A.
P.E. Pehrsson
Affiliation:
Electronic Technology Division, Naval Research Lab., Washington, D.C. 20375-5000, U.S.A.
M. Halliwell
Affiliation:
Wright Patterson Air Force Base, Dayton, Ohio 45433, U.S.A.
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Abstract

This work is aimed at studying the feasibility of laser induced, high-speed, highly selective direct deposition of metals on substrates immersed in commercial electroplating solutions without masking procedures and external electric current.

A Q-Switch Nd/YAG pulsed laser system and excimer UV pulsed laser systems operating respectively at wavelength of 532nm and at 193 and 248nm, were used in conjunction with commercial basic potassium gold cyanide and acidic gold tetrachloride solutions. The substrates were semiconductors (silicon, gallium arsenide and silicon carbide), metallic (platinum) and polymeric (polyimide).

The morphology, structure, composition and properties of the gold deposits were examined by the SEM, TEM, X-ray, AES and ESCA techniques.

Deposits were found to consist of elemental gold with thickness range from a few hundred angstroms to several micrometers, depending primarily on laser energy density and on the number of pulses. Deposition occurred wherever band gap energies (plus surface barrier) were smaller than the laser photon energy; none was observed in reverse situations, as in the cases of Si3N4 and fused SiO2.

The deposits exhibited Schottky barrier contacts on silicon, silicon carbide and gallium arsenide.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1 Gutfeld, R.J. von, Tynan, E.E., Melcher, R.L. and Blum, S.E., Appl. Phys. Lett. 35 (9), 651 (1979).Google Scholar
2 Puippe, J.C., Acosta, R.E. and Gutfeld, R.J. von, J. Electro-chera. Society, 128(12), 2539 (1981).Google Scholar
3 Tamir, S., Zahavi, J., J. Vac. Sci. Tech. A, 3(6),2312(1985).Google Scholar
4 Zahavi, J., Tamir, S. and Halliwell, M., Plating and Surface Finishing, pp 5764, February (1986).Google Scholar
5 Zahavi, J., Tamir, S. and Halliwell, M., in Materials Issues in Silicon Integrated Circuit Processing edited by Wittmer, W., Stimmell, J., Strathnan, M. (Material Research Society, Pittsburgh, Pennsylvania, 1986), p. 387.Google Scholar
6 Karlicek, R.F., Donnelly, V.M. and Collins, G.J., J. Appl. Phys 53(2),1084, February (1982).Google Scholar
7 Zahavi, J. and Pehrson, P.E., In Photon, Beam and Plasma Stimulated Chemical Processes at Surfaces edited by Donnelly, V.M., Herman, I.P. and Hirose, M. (Material Research Society, Pittsburgh, Pennsylvania, (1987), p. 173.Google Scholar
8 Zahavi, J., Pehrsson, P.E., Campisi, G.J. and Greene, R.F., “UV Laser Induced Metal Deposition on Semiconductors and Metals from Electroplating Solutions”, in preparation for submittin to J. Electrochem. Society.Google Scholar
9 Felske, A. and Plieth, W.J., J. Optical Society of America, 3(5), 815(1986).Google Scholar
10 Podlesnik, D.V., Gilgen, H.H., Willner, A.E. and Osgood, R.M., J Optical Society of America, 3(5),775(1986).Google Scholar
11 Gurevich, Yu. Ya, Pleskov, Yu. V. and Rotenberg, Z.A., “Photoelectro-Chemistry”, Consultants Bureau, N.Y. (1980).Google Scholar