Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-25T15:31:27.402Z Has data issue: false hasContentIssue false

Kinetics of Surface Roughening and Smoothing During Ion Sputtering

Published online by Cambridge University Press:  15 February 2011

E. Chason
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185–0350
T. M. Mayer
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185–0350
A. J. Howard
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185–0350
Get access

Abstract

We have measured the kinetics of roughness evolution during low energy ion sputtering of SiO2 surfaces using in situ X-ray reflectivity. Sputtering with heavy ions (Xe) leads to rapid roughening of the surface that can not be explained by a simple random removal process. Subsequent bombardment with light ions (He, H) leads to an exponential decrease in the surface roughness. These kinetics are explained quantitatively by a linear model that contains a balance between smoothing by surface diffusion and viscous flow and roughening by sputter removal of Material. A curvature dependent sputter yield leads to amplification of a limited range of spatial frequencies on the surface and the formation of a ripple topography.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Picraux, S. T., Chason, E., Mayer, T. M.. Bull. Mater. Res. Soc. 17 (6), 54 (1992).Google Scholar
2. Carter, G. C, Navinsek, B., Whitton, J. L., Sputtering by Ion Bombardment II, Behrisch, R., ed. (Springer, Berlin, 1983).Google Scholar
3. Cirlin, E. H., Vajo, J. J., Doty, R. E., Hasenberg, T. C., J. Vac. Sci. Technol. A 9, 1395 (1991).Google Scholar
4. Snyder, P. G.. Massengale, A., Memarsadeh, K., Woolam, J. A., Ingram, D. C., Pronko, P. P., Mat. Res. Soc. Proc. 74, 535 (1987).Google Scholar
5. Oyoshi, K.. Tagami, T., Tanaka, S., Jap. J. Appl. Phys. 30, 1854 (1991).Google Scholar
6. Volkert, C. A., Pohlman, A., Mat. Res. Soc. Proc. 235, 3 (1992).Google Scholar
7. Primak, W., Compacted States of Vitreous Silica, (Gordon and Breach, New York, 1975).Google Scholar
8. Eklund, E. A., Bruinsma, R., Rudnick, J., Williams, R. S., Phys. Rev. Lett. 67, 1759 (1991).Google Scholar
9. Eklund, E. A., Snyder, E. J., Williams, R. S., Surf. Sci. 285, 157 (1993).Google Scholar
10. Krim, J., Heyvaert, I., Van Haesendonck, C., Bruynseraede, Y., Phys. Rev. Lett. 70, 57 (1993).Google Scholar
11. Chason, E., Mayer, T. M., Payne, A., Wu, D., Appl. Phys. Lett. 60, 2353 (1992).Google Scholar
12. Chason, E., Mayer, T>M., Appl. Phys. Lett. 62, 363 (1993).M.,+Appl.+Phys.+Lett.+62,+363+(1993).>Google Scholar
13. Mayer, T.M., Chason, E. and Howard, A.J., J. Appl. Phys., submitted.Google Scholar
14. Bradley, R. M., Harper, J. M. E., J. Vac. Sci. Technol. Ai, 2390 (1988).Google Scholar
15. Chason, E., Warwick, D. T., Mater. Res. Soc. Symp. Proc. 208, 351 (1991).Google Scholar
16. Parra, L. G. Phys. Rev. 95, 359 (1954).Google Scholar
17. Azzam, R. M. A., Bashara, N. M., Ellipsometry and Polarized Light, (North Holland, Amsterdam, 1977), Ch. 4.Google Scholar
18. Beckmann, P., Spizzichino, A., The Scattering of Electromagnetic Waves from Rough Surfaces, (Pergamon, New York, 1963).Google Scholar
19. Zhong, Q., Inniss, D., Kjoller, K., Elings, V. B., Surf. Sci. Lett. 290, L688 (1993).Google Scholar
20. Herring, C in Physics ofPowder Metallurgy, Kingston, W. E., ed. (McGraw-Hill, New York, 1951).Google Scholar
21. Mullins, W. W., J. Appl. Phys. 30, 77 (1959).Google Scholar
22. Sigmund, P., Phys. Rev. 184, 383 (1970); J. Mater. Sci. 8, 1545 (1973).Google Scholar
23. Ziegler, J. F., Biersack, J. P., Littmark, U., The Stopping and Range of Ions in Solids, (Pergamon Press, New York, 1985).Google Scholar
24. Chason, E., Mayer, T.M., Kellerman, B.K., Mcllroy, D.N. and Howard, A.J., Phys. Rev. Lett., submitted.Google Scholar