Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-27T01:40:43.807Z Has data issue: false hasContentIssue false
  • English
  • Français

Isothermal Fatigue of 62Sn–36Pb–2Ag Solder

Published online by Cambridge University Press:  26 February 2011

Semyon Vaynhan  and
Morris E. Fine
Semyon Vaynhan
Affiliation:
Basic Industry Research Laboratory and Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
Morris E. Fine
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
Get access

Abstract

This paper discusses the effects of the most important variables during isothermal fatigue such as strain range, ramp time, tensile and compressive hold times, and temperature on fatigue life of near–eutectic 62Sn–36Pb–2Ag solder at strain ranges below 3.0%. The Coffin-Manson relation does not hold for 62Sn–36Pb–2Ag solder below 1% strain range. Decreasing frequency below 10-2 in no-hold tests reduces the number of cycles to failure. Tensile hold time or compressive hold time alone in the cycle dramatically reduce the number of cycles to failure. Increase of hold time over a few minutes leads to saturation of Nf. Combined tensile and compressive hold times affect the fatigue life of this solder less than either tensile or compressive hold alone. The effect of hold times on fatigue life is much stronger than the effect of ramp time. Practically no ramp time effect was observed in tests with tensile hold times. Very little effect of temperature over the range 25 to 80°C on fatigue life of 62Sn–36Pb–2Ag solder was observed when tested at total strain range of 1%.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 3
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Lau, J.H. and Rice, D.W., Solid State Technol., 28(10), 91–104 (1985).Google Scholar
2. Burges, J.F. et al. , IEEE Transactions on Components, Hybrids, and Manufacturing Technology, CHMT-7 (4), 405–410 (1984).Google Scholar
3. Coffin, L.F., Trans. ASME, 76, 931–950 (1954).Google Scholar
4. Manson, S.S., Experimental Mechanics, 5 (7), 193–226 (1965).Google Scholar
5. Vaynman, S., Fine, N.E., Jeannotte, D.A., Metall. Trans., 19A, 1051–1056 (1988).Google Scholar
6. Vaynman, S., Fine, N.E., Jeannotte, D.A.,in Proceedings of 37th Electronic Components Conference, (IEEE, 1987), pp. 598–603.Google Scholar
7. Vaynman, S., Fine, M.E., Jeannotte, D.A., in Proc. Effect of Load and Thermal Histories on Mechanical Behavior SVmp., ed. Liaw, P.K., Nicholas, T., (TMS, 1987), pp. 127–137.Google Scholar
8. Berriche, R., Vaynman, S., Fine, N.E., Jeannotte, D.A., in Proc. 3rd Ann. Electronic Packaging and Corrosion in Microelectronics Conf., ed. Nicholson, N.E., (ASM International, 1987), pp. 169–174.Google Scholar
9. Berriche, R., “Environmental Effects on Time Dependent Fatigue of Low Tin-High Lead Solder”, PhD Thesis, Northwestern University, Evanston, IL, 1989.Google Scholar
10. Cutiongco, E.C., Vaynman, S., Fine, M.E., Jeannotte, D.A., J. Electronic Packaging, 112, 110–114 (1990).Google Scholar
11. Eckel, J.F., Proc. ASTN, 51, 745–760 (1957).Google Scholar
12. Solomon, H.D., in Electronic Packaging: Materials and Processes, ed. Sortell, J.A., (ASM 1985), pp. 29–49.Google Scholar
13. Solomon, H.D., in Low-Cycle Fatigue. ASTM STP-942, ed. Solomon, H.D. et al. , ASTM 1988), pp. 342–369.Google Scholar
14. Solomon, H.D., J. of Electronic Packaging, 111, 75–90 (1989).Google Scholar
15. Vaynman, S., IEEE Transactions on Components, Hybrids, and Manufacturing Technology, CHMT-12 (4), 469–472 (1989).Google Scholar
30. Agarwala, B.N., in 23rd Annual Proceedings. Reliability Physics IEEE/IRPS, pp. 198–205 (1985).Google Scholar
31. Vaynman, S., in Proceedings of 40th Electronic Components and Technology Conference, (IEEE, 1990), pp. 505–509.Google Scholar
32. Vaynman, S., Scripta Metall., 21, 1385–1387 (1987).Google Scholar
33. Kitano, M., Shimizu, T., Kumazava, T., Current Japanese Materials Research, 2 235–250 (1987).Google Scholar
34. Frear, D., Grivas, D., McCormack, M., Tribula, D., Morris, J.W. Jr, in Proc. 3rd Ann, Electronic Packaging and Corrosion in Microelectronics Conf, ed. Nicholson, M.E., (ASM International, 1987) pp. 269–274.Google Scholar
35. Frear, D., Grivas, D., McCormack, M., Tribula, D., Morris, J.W. Jr, in Proc. Effect of Load and Thermal Histories on Mechanical Behavior Symn., ed. Liaw, P.K., Nicholas, T., (TMS, 1987), pp. 113–126.Google Scholar
36. Greenwood, P.J., Reiley, T.C., Raman, V., Tien, J.K., Scripta Metall., 22,1465–1468 (1988).Google Scholar
37. Vaynman, S., in Proceedings of InterSociety Conference on Thermal Phenomena in Electronic Systems (I-Therm II), (IEEE, 1990), pp. 16–20.Google Scholar