Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-24T15:22:42.218Z Has data issue: false hasContentIssue false

Is There a Way to a Perfect Rapid Thermal Processing System?

Published online by Cambridge University Press:  28 February 2011

R. Kakoschke*
Affiliation:
Siemens AG, HL PE 21, Otto-Hahn-Ring 6, D-8000 Mijinchen 83, FRG
Get access

Abstract

The temperature within a rapid thermal processing system is characterized by the intensity distributions of the lamp light and of the reabsorbed heat radiation of the wafer. The intensity to the front and back side of the wafer and to the wafer edge have to be considered for pattern induced effects and additional energy loss at the edge, respectively. Monte-Carlo simulations show that the major problems with a multi lamp arrangement with surrounding reflector are due to nonuniform irradiation by the lamps, nonuniform energy loss of the wafer, and additional energy loss at the wafer edge. The temperature influencing quantities cannot be optimized at the same time without modifications of the reflector geometry or without a subsidiary light flux which is controllable independently of the lamp light.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Roozeboom, F., Parekh, N., J. Vac. Sc. Technol. B, in pressGoogle Scholar
lsqb;2] Kakoschke, R., Bulβmann, E., Föll, H., Appl. Phys. A 50, 141 (1990)Google Scholar
[3] Kakoschke, R., Bullmann, E., Föll, H.: Appl. Phys. A 52, 52 (1990)Google Scholar
[4] Kakoschke, R.: Nucl. Instr. and Meth. (Proceedings of the 8 th International Conference on Ion Implantation and Technology) B37/38, 753 (1989)Google Scholar
[5] Mehta, S., Hodul, D.: In Rapid Thermal Processing of Electronic Materials, eds. Wilson, S.R., Powell, R., Davies, D.E. (MRS Symp. Proc., Pittsburgh, 1987), p. 95 Google Scholar
[6] Vandenabeele, P., Maex, K., De Keersmaecker, R. in: “Rapid Thermal Annealing/Chemical Vapor Deposition and Integrated Processing”, edited by Hodul, D., Gelpey, J., Green, M., Seidel, T. (Mat. Res. Soc. Proc., April 1989), p. 149 Google Scholar
[7] Vandenabeele, P., Maex, K. in: “In Rapid Thermal and Related Processing Techniques”, eds. Singh, R. and Moslehi, M.M. (SPIE Proc., 2-3 October 1990, Santa Clara), p. 1393 Google Scholar
[8] Kakoschke, R., BuBmann, E. in: “Rapid Thermal Annealing/Chemical Vapor Deposition and Integrated Processing”, edited by Hodul, D., Gelpey, J., Green, M., Seidel, T. (Mat. Res. Soc. Proc., April 1989), p. 473 Google Scholar
[9] Vandenabeele, P., Maex, K., Proceedings of the SPIE-symposium on “Rapid Isothermal Processing” (12-13 October 1989), ed by Singh, R. (vol. 1189), 89 Google Scholar
[10] Lord, H.A., Proceedings of the SPIE-symposium on “Rapid Isothermal Processing” (12-13 October 1989), ed by Singh, R. (vol. 1189), 41 Google Scholar
[11] Sorrell, F.Y., Eakes, C.P., Ozturk, M.C., Wortman, J.J., Proceedings of the SPIE-symposium on “Rapid Isothermal Processing” (12-13 October 1989), ed by Singh, R. (vol. 1189), 55 Google Scholar
[12] Vandeenabele, P., private communicationGoogle Scholar