Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-25T15:13:04.570Z Has data issue: false hasContentIssue false

Ion Milling of Compound Semiconductors for Transmission Electron Microscopy

Published online by Cambridge University Press:  21 February 2011

A G Cullis
Affiliation:
Royal Signals and Radar Establishment, St Andrews Road Malvern, Worcestershire WR14 3PS, England
N G Chew
Affiliation:
Royal Signals and Radar Establishment, St Andrews Road Malvern, Worcestershire WR14 3PS, England
Get access

Abstract

Serious artefactual structures can be introduced into transmission electron microscope specimens of compound semiconductors when the latter are prepared by ion milling under non-optimum conditions. In the present investigations, the nature of these artefacts is characterised and results obtained using conventional argon ion milling are compared with those obtained using alternative ion species, including iodine ions. This work demonstrates the large improvement in specimen structural quality which can be achieved by combining a logical selection of ion species with a careful choice of milling conditions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Irving, B.A., Brit. J. Appl. Phys. 12, 92 (1961).CrossRefGoogle Scholar
2. Booker, G.R. and Stickier, R., Brit. J. Appl. Phys. 13, 446 (1962).Google Scholar
3. Pettit, H.R. and Booker, G.R. in Proc. of the 25th Anniversary Meeting of EMAG, edited by W.C. Nixon (Inst. Phys. Conf. Ser. 10, Bristol, 1971) p. 290.Google Scholar
4. Abrahams, M.S. and Buiocchi, C.J., J. Appl. Phys. 45, 3315 (1974).Google Scholar
5. Cullis, A.G. and Farrow, R.F.C., Thin Solid Films 58, 197 (1979).Google Scholar
6. Chew, N.G. and Cullis, A.G., Appl. Phys. Lett. 44, 142 (1984).Google Scholar
7. Cullis, A.G., Chew, N.G. and Hutchison, J.L., Ultramicroscopy 17, 203 (1985).Google Scholar
8. Sinclair, R., Ponce, F.A., Bravman, J.C., Yamashita, T. and Pirouz, P. in Microscopy of Semiconducting Materials 1981, edited by Cullis, A.G. and Joy, D.C. (Inst. Phys. Conf. Ser. 60, Bristol, 1981) p. 147.Google Scholar
9. Smith, D.J., Ponce, F.A., Yamashita, T. and Sinclair, R., in Proc. 7th High Voltage Electron Microscopy Conf., Berkeley, (1983), p. 31.Google Scholar
10. Mizera, M. and Lundberg, M., in Proc. 8th European Congr. on Electron Microscopy, Budapest, (1984), p. 945.Google Scholar
11. Williams, J.O., Ng, T.L., Wright, A.C., Cockayne, B. and Wright, P.J., J. Crystal Growth 68, 237 (1984).Google Scholar
12. Chew, N.G. and Cullis, A.G., Ultramicroscopy 3, 175 (1987)Google Scholar
13. Katschner, W., Niggebrüge, U., Löffler, R. and Schröter-Jansen, H., Appl. Phys. Lett. 48, 230 (1986).Google Scholar
14. Hutchison, J.L., private communication.Google Scholar
15. Gibson, J.M. and McDonald, M.L., in Characterization of Defects in Materials, edited by Siegel, R.W., Sinclair, R. and Weertman, J.R. (Mater. Res. Soc. Proc. 82, Pittsburgh, 1987) p. 109.Google Scholar
16. Lunn, M.A. and Dobson, P.S., J. Crystal Growth 73, 379 (1985).Google Scholar