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Investigation of Wear of Microelectromechanical Contacts

Published online by Cambridge University Press:  10 February 2011

Brian J. Gally ,
C. Cameron Abnet  and
Stuart Brown
Brian J. Gally
Affiliation:
Exponent Failure Analysis Associates, Natick, MA 01760
C. Cameron Abnet
Affiliation:
Exponent Failure Analysis Associates, Natick, MA 01760
Stuart Brown
Affiliation:
Exponent Failure Analysis Associates, Natick, MA 01760
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Abstract

A test system has been assembled to examine factors controlling the reliability of microdevice switching. The system consists of a spherically tipped sputter-coated post driven by a piezoresistive actuator into a sputter-coated micromechanical membrane. Contact forces are calculated based upon the measured deflection of the micromechanical membrane, which is induced by post actuation. Membrane deflection is measured using white light interferometry. The known geometry of the membrane and probe tip permits the estimation of contact area and, hence, contact pressure. Preliminary testing of sputtered gold contacts resulted in localized melting, material transport to the membrane and failure of contact surfaces at relatively low contact pressures and current densities. Further testing will examine the factors governing the reliability of microdevice contacts, such as material properties, contact pressure and current density.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 605: Symposium MM – Materials Science of Microelectromechanical Systems Devices II , 1999 , 117
Copyright
Copyright © Materials Research Society 2000

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