Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-20T01:31:22.425Z Has data issue: false hasContentIssue false
  • English
  • Français

Investigation of Aluminum Thin Films Using Electron Backscatter Diffraction and the New Technique of Orientation Imaging Microscopy

Published online by Cambridge University Press:  15 February 2011

D. J. Dingley  and
D. P. Field
D. J. Dingley
Affiliation:
On sabbatical from University of Bristol, Bristol BS81TL, United Kingdom
D. P. Field
Affiliation:
TexSEM Laboratories, Provo, Utah 84604
Get access

Abstract

Aluminum thin films deposited onto silicon substrates coated with silicon dioxide or a layered structure of titanium and titanium nitride have been investigated using the combined techniques of electron backscatter diffraction and orientation imaging microscopy. By these methods the local texture and spatial distribution of texture components was established. It was observed that whereas the material exhibited an overall <111> texture with the in-plane direction <110> uniformly distributed, there were variations in the local texture and distribution of orientations with clustering of grains of similar orientation. Individual grains within the clusters were nearly perfect and varied in orientation by only a few degrees. The effective grain size differed greatly on whether the cluster size of similarly oriented grains or the diameter of individual grains within the cluster was considered to constitute the grain structure. No strong bias was found in favor of coincident site oriented grain pairs though in some cases the frequency of occurrence of low angle boundaries was less than is expected on a purely random basis. Additional experiments were carried out in order to establish the suitability of orientation imaging microscopy for microstructure characterization of interconnect lines in integrated semiconductor device technology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 403: Symposium I – Polycrystalline Thin Films: Structure, Texture, Properties and Applications II , 1995 , 197
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Field, D.P., Ph.D Thesis, Yale University (1991).Google Scholar
2. Mason, T.A., Ph.D Thesis, Yale University (1994).Google Scholar
3. Dingley, D.J., Longdon, M.J., Weinbren, M.J. and Alderman, J., Scanning Microscopy 1, 451 (1987).Google Scholar
4. Wright, S.I. and Adams, B.L., Metallurgical Transactions 23A, 759 (1992).Google Scholar
5. Knorr, D.B., Mat. Res. Soc. Symp. 309, 75 (1993).Google Scholar
6. Nix, W.D., Met. Trans. 20A, 2217 (1989).Google Scholar
7. Sanchez, J.E. Jr., and Artz, E., Scripta metall. et mater. 27, 285 (1992).Google Scholar
8. Thompson, C.V., J. Mater. Res. 8, 237 (1993).Google Scholar
9. Gerth, D. and Schwarzer, R.A., Materials Science Forum 113–115, 625 (1992).Google Scholar
10. Schwarzer, R.A. and Gerth, D., J. Elect. Mater., in press (1995).Google Scholar
11. Kaneko, H., Hasunuma, M., Swabe, A, Kohanawa, Y., Komatsu, S. and Miyauchi, M., Proc 28th Reliability Physics Symposium, IEEE, New York, 21 (1990).Google Scholar
12. Ogawa, S. and Inoue, M., Stress-induced Phenomena in Metallisation, ed Li, C.Y., Totta, P. and Ho, P., Am. Inst. of Phys. Conf. Proc., 236, 21, New York (1992).Google Scholar
13. Campbell, A.N. and Milkawa, R.E., J. Elect. Mater. 22, 589 (1993).Google Scholar
14. Lee, K.T., Szpunar, J.A., Morawiec, A., Knorr, D.B. and Rodbell, K.P., Can. Metall. Quarterly, To be published (1995).Google Scholar
15. Vaidya, S. and Sinha, A.K., Thin Solid Films 75, 253 (1981).Google Scholar
16. Walton, D.T., Frost, H.J. and Thompson, C.V., Mater. Res. Soc. Proc. 225, 219 (1991).Google Scholar
17. Pan, Y. and Adams, B.L., Scripta metall. et mater. 30, 1055 (1995).Google Scholar
18. Adams, B.L., Wright, S.I. and Kunze, K., Metall. Trans. 24, 819 (1993).Google Scholar
19. Wright, S.I., Adams, B.L. and Kunze, K., Matls. Sci. Engg. A166, 59 (1993).Google Scholar
20. Venables, J.A. and Harland, C.J., Phil. Mag. 27, 1993 (1973).Google Scholar
21. Dingley, D.J. and Randle, V., J. Mater. Sci. 27, 4545 (1992).Google Scholar