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Investigating thiol-epoxy composites for semiconductor die attach adhesives

Published online by Cambridge University Press:  29 May 2015

Andrew Wei ,
Radu Reit  and
Walter Voit
Andrew Wei
Affiliation:
Department of Electrical Engineering, University of Texas at Dallas, 800 W. Campbell Rd., Richardson, TX 75080, U.S.A.
Radu Reit
Affiliation:
Department of Bioengineering, University of Texas at Dallas, 800 W. Campbell Rd., Richardson, TX 75080, U.S.A.
Walter Voit
Affiliation:
Department of Materials Science and Engineering, University of Texas at Dallas, 800 W. Campbell Rd., Richardson, TX 75080, U.S.A.
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Abstract

In this study, thiol-epoxy polymer composites are explored as candidates for high-temperature die attach applications. We present a polymer composite processing technique for die attach adhesives with low cure-stress. Lap shear samples of both a polymer adhesive and current industry adhesives were subjected to tensile testing and die shear strength was compared. At 260 °C, the candidate polymer adhesive exhibited a die shear strength of 0.500 MPa in comparison with 1.35 MPa and 0.258 MPa for two control adhesives. While samples showed less variation in properties in die shear strength between room temperature and 260 °C, the absolute die shear strength values were inferior to commercial adhesives at both room and elevated temperatures. We hypothesize that low cure stress networks, such as the thiol-epoxies presented, provide a compelling choice to engineer new die attach adhesives, but realize that further network refining is needed including the addition of adhesion promoters and other additives, a task better suited to industrial research with a focus in properties optimization.

Keywords

adhesivecompositeviscoelasticity
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1718: Symposium B – Multifunctional Polymeric and Hybrid Materials , 2015 , pp. 27 - 31
Copyright
Copyright © Materials Research Society 2015 

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References

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