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Internal Stresses and Damping in Ni/Cu Multilayered Thin Films

Published online by Cambridge University Press:  25 February 2011

C. M. Su ,
R. R. Oberle ,
R. C. Cammarata  and
Manfred Wuttig
C. M. Su
Affiliation:
University of Maryland, Department of Materials and Nuclear Engineering, College Park, MD 20742
R. R. Oberle
Affiliation:
The Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD 21218
R. C. Cammarata
Affiliation:
The Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD 21218
Manfred Wuttig
Affiliation:
University of Maryland, Department of Materials and Nuclear Engineering, College Park, MD 20742
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Abstract

The internal stresses and anelastic properties of an electrodeposited Ni/Cu multilayered membrane as measured dynamically using a vibrating membrane method are reported. Our results indicate that the as-deposited membrane has a high internal stress approaching the yield strength. Due to the accuracy of the experimental method, the damping of the multilayered membrane can be measured in the presence of the high internal stresses. It is shown that the relatively large damping capacity exhibited by the multilayered film is different from classical damping associated with the modulus defect, and may be related to an interfacial relaxation effect such as sliding.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 280: Symposium B – Evolution of Surface and Thin Film Microstructure , 1992 , 527
Copyright
Copyright © Materials Research Society 1993

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References

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