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Internal Stresses and Adhesion Properties of Film/Substrate Interfaces

Published online by Cambridge University Press:  16 February 2011

M. Ignat ,
A. Chouaf  and
Ph. Normandon
M. Ignat
Affiliation:
L.T.P.C.M. ENSEEG, BP 75- Domaine Universitaire -38402 Saint Martin d'Hères
A. Chouaf
Affiliation:
L.T.P.C.M. ENSEEG, BP 75- Domaine Universitaire -38402 Saint Martin d'Hères
Ph. Normandon
Affiliation:
Centre National d'Etudes des Télécommunications - BP 98-38243 Meylan Cedex
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Abstract

The evolution of internal stresses in Tungsten films deposited on Silicon substrates submitted to external stresses is discussed here. The stresses are estimated and measured by theoretical and experimental methods. The discussion of the internal stress evolution is shown to be dependent of the film/substrate interfaces, and of the loss of adhesion inducing stress relaxation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 188: Symposium K – Thin Films: Stresses and Mechanical Properties II , 1990 , 97
Copyright
Copyright © Materials Research Society 1990

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References

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