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Interface Reaction Kinetics for Permalloy-Tantalum Thin Film Couples

Published online by Cambridge University Press:  15 February 2011

A.J. Kellock ,
J.E.E. Baglin ,
K.R. Coffey ,
J.K. Howard ,
M.A. Parker  and
D.L. Neiman
A.J. Kellock
Affiliation:
IBM Almaden Research Center, 650 Harry Rd., San Jose, CA 95120
J.E.E. Baglin
Affiliation:
IBM Almaden Research Center, 650 Harry Rd., San Jose, CA 95120
K.R. Coffey
Affiliation:
IBM Storage Systems Division, 5600 Cottle Rd, San Jose, CA 95193
J.K. Howard
Affiliation:
IBM Storage Systems Division, 5600 Cottle Rd, San Jose, CA 95193
M.A. Parker
Affiliation:
IBM Storage Systems Division, 5600 Cottle Rd, San Jose, CA 95193
D.L. Neiman
Affiliation:
IBM Almaden Research Center, 650 Harry Rd., San Jose, CA 95120
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Abstract

Thermal interdiffusion mechanisms and kinetics have been studied for Ta-Permalloy (Ni80Fe20), Ta-Ni and Ta-Fe thin film couples, in the temperature range 300°C - 600°C. Interaction modes identified for the Ta-NiFe system include: fast diffusion of Ta into grain boundaries of NiFe, and nucleation and growth of Ni3Ta, with consequent depletion of Ni in the remaining NiFe, and eventual segregation of Fe.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 343: Symposium H – Polycrystalline Thin Films - Structure, Texture, Properties and Applications , 1994 , 211
Copyright
Copyright © Materials Research Society 1994

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References

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