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Interaction of Cu and CoSi2

Published online by Cambridge University Press:  25 February 2011

C. L. Shepard ,
W. A. Lanford ,
Y-T. Shy  and
S. Murarka
C. L. Shepard
Affiliation:
Physics Dept., State University of New York, Albany, NY, 12222
W. A. Lanford
Affiliation:
Physics Dept., State University of New York, Albany, NY, 12222
Y-T. Shy
Affiliation:
Materials Engineering Dept., RPI, Troy, NY, 12180
S. Murarka
Affiliation:
Materials Engineering Dept., RPI, Troy, NY, 12180
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Abstract

Interaction of thin film Cu and CoSi2 has been studied using Rutherford backscattering spectroscopy and sheet resistance measurements. For temperatures ≤ 600° C. , no measurable diffusion of Cu into CoSi2 is observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 181: Symposium B – Advanced Metallizations in Microelectronics , 1990 , 105
Copyright
Copyright © Materials Research Society 1990

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References

REFERENCES

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