Article contents
Interaction between abrasive particles and film surfaces in low down force Cu CMP
Published online by Cambridge University Press: 15 March 2011
Extract
A robust copper slurry should have high removal rate, efficient planarization, optimal over polishing window and fast clearing without corrosion. These requirements were addressed in the choice of abrasive particles, film formation for copper passivation, selectivity of copper to barrier, and interactions between particles and film surfaces. The performance results of low dishing erosion and surface finish are discussed with the proposed mechanism.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 2004
References
- 4
- Cited by