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Intense Pulsed Light Sintering of Inkjet Printed Silver Nanoparticle Ink: Influence of Flashing Parameters and Substrate

Published online by Cambridge University Press:  10 July 2015

Dana Weise ,
Kalyan Yoti Mitra ,
Enrico Sowade  and
Reinhard R. Baumann
Dana Weise
Affiliation:
Institute for Print and Media Technology, Department of Digital Printing and Imaging Technology, Technische Universität Chemnitz, Germany
Kalyan Yoti Mitra
Affiliation:
Institute for Print and Media Technology, Department of Digital Printing and Imaging Technology, Technische Universität Chemnitz, Germany
Enrico Sowade
Affiliation:
Institute for Print and Media Technology, Department of Digital Printing and Imaging Technology, Technische Universität Chemnitz, Germany
Reinhard R. Baumann
Affiliation:
Institute for Print and Media Technology, Department of Digital Printing and Imaging Technology, Technische Universität Chemnitz, Germany Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
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Abstract

Inkjet printing of various nanoparticle inks, made from silver or copper nanoparticles, and its transformation into solid functional patterns is of high interest in the field of printed electronics. Liquid materials can be deposited as defined patterns in selected areas with micrometer precision. To convert these printed liquid films, consisting of solvents, additives and nanoparticles, into solid functional patterns a post-treatment is required. To this date, many investigations report on various sintering techniques to achieve e.g. high conductivity from the printed conductive materials.

Direct thermal sintering (via furnace or hotplate) requires high temperatures, which makes it not suitable for sensitive polymeric substrates. The novel method of intense pulsed light (IPL) sintering opens the window of opportunity to convert liquid or dried metal layers into solid functional layers within milliseconds without damaging the thermally fragile polymeric substrate.

In this work we present and analyze the application of the IPL sintering on inkjet printed silver patterns on various flexible substrates, like Poly(ethylene naphthalate) (PEN), Poly(ethylene terephthalate) (PET), Polyimide (PI) foils and paper.

A high dependency of the electrical and structural performance of the printed silver layers on the base substrate was observed when flashing with the IPL technique. Flashing parameters were varied and the resulting sheet resistance is presented.

With the analytical comparison of optical and electrical results, the flashing settings could be adapted to achieve highly conductive inkjet printed silver patterns on flexible substrates, when compared to other thermal sintering techniques. Furthermore the first integration of this post treatment methodology into semi-industrial roll-2-roll processing was successfully performed and will be demonstrated.

Keywords

ink-jet printingsinteringelectrical properties
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1761: Symposium ZZ – Hierarchical, High-Rate, Hybrid and Roll-to-Roll Manufacturing , 2015 , mrsf14-1761-zz05-04
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Greer, J. R. and Street, R. A., Acta Materialia 55(18), 6345–6349 (2007)CrossRefGoogle Scholar
Klauk, H., Organic Electronics, Materials, Manufacturing and Applications, WILEY-VCH, 2006.CrossRefGoogle Scholar
Chiolerio, A., Maccioni, G., Martino, P., Cotto, M., Pandolfi, P., Rivolo, P., Ferrero, S. and Scaltrito, L., Microelectron. Eng. 88(8), 2481–2483, 2011 CrossRefGoogle Scholar
Tobjörk, D., Aarnio, H., Pulkkinen, P., Bollström, R., Määttänen, A., Ihalainen, P., Mäkelä, T., Peltonen, J., Toivakka, M., Tenhu, H. and Österbacka, R., Thin Solid Films 520(7), 2949–2955 (2012)CrossRefGoogle Scholar
Park, S.-H., Jang, S., Lee, D.-J., Oh, J. and Kim, H.-S., J. Micromech. Microeng. 23(1) (2013)Google Scholar
Perelaer, J. and Schubert, U. S., J. Mater. Res. 28(4), 564–573 (2013)CrossRefGoogle Scholar
Niittynen, J., Abbel, R., Mäntysalo, M., Perelaer, J., Schubert, U. S., Lupo, D., Thin Solid Films 556, 452–459 (2014)CrossRefGoogle Scholar
Kang, H., Sowade, E. and Baumann, R. R., Applied Materials & Interfaces 6(3), 1682–1687 (2014)CrossRefGoogle Scholar
Abbel, R., MRS Communications 2(4), 145–150 (2012)CrossRefGoogle Scholar
Perelaer, J., Abbel, R., Wünscher, S., Jani, R., van Lammeren, T. and Schubert, U. S., Adv. Mater. 24(19), 2620–2625 (2012)CrossRefGoogle Scholar