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In-situ Tensile Straining of Metal Films on Polymer Substrates under an AFM

Published online by Cambridge University Press:  15 May 2013

M.J. Cordill  and
V.M. Marx
M.J. Cordill
Affiliation:
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben, 8700, Austria
V.M. Marx
Affiliation:
Max-Planck-Institut für Eisenforschung GmbH, Max-Planck-Straße 1, 40237 Düsseldorf, Germany
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Abstract

Metal films on polymer substrates are commonly used in flexible electronic devices and as gas barrier coatings. One way to evaluate the fracture and adhesion properties of such film systems is the fragmentation test. In the fragmentation test a film-substrate system is strained in tension under an optical microscope or inside a scanning electron microscope to observe the cracking and delamination events in situ. The technique works very well for brittle metal and ceramic films. However, when ductile films are strained they deform plastically before cracks and buckles appear. Therefore, a tensile straining device was developed to fit under an AFM for in situ observation of ductile metal films on polymer substrates. With the new in situ device the first occurrence of plastic deformation in the form of localized thinning of the film and channel cracks are visible. These features can only be detected through a height difference in the AFM images and not with optical or scanning electron micrographs. A comparison to brittle Cr films on polymer substrates was performed.

Keywords

fracturethin filmCu
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1527: Symposium UU – Scanning Probe Microscopy―Frontiers in Nanotechnology , 2013 , mrsf12-1527-uu06-07
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Curtin, WA, J. Mater. Sci. 26, 5239–5253 (1991)CrossRefGoogle Scholar
Hu, MS, Evans, AG, Acta Metall. 37, 917–925 (1989)CrossRefGoogle Scholar
Agrawal, DC, Raj, R, Acta Metall. 37, 1265–1270 (1989)CrossRefGoogle Scholar
Cordill, MJ, Taylor, A, Schalko, J, Dehm, G, Metall. Mater. Trans. A 41, 870–875 (2010)CrossRefGoogle Scholar
Frank, S, Handge, UA, Olliges, S, Spolenak, R, Acta Mater. 57, 1442–1453 (2009)CrossRefGoogle Scholar
Andersons, J, Leterrier, Y, Tornare, G, Dumont, P, Manson, J-AE, Mech.Mater. 39, 834–844 (2007)CrossRefGoogle Scholar
Cordill, MJ, Schmidegg, K, Dehm, G, Phil. Mag. Lett. 91, 530–536 (2011)CrossRefGoogle Scholar
Lu, N., Wang, X., Suo, Z., J. Vlassak: J. Mater. Res. 24 (2009) 379.Google Scholar
Grego, S., .Lewis, J, Vick, E., Temple, D., Thin Solid Films 515 (2007) 4745–4752.CrossRefGoogle Scholar