Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-27T02:24:52.445Z Has data issue: false hasContentIssue false

In-situ real time studies of nickel silicide formation

Published online by Cambridge University Press:  10 February 2011

M. Tinani
Affiliation:
Department of Chemistry, University of North Carolina, Chapel Hill, NC 27599
E.A. Irene
Affiliation:
Department of Chemistry, University of North Carolina, Chapel Hill, NC 27599
Y.Z. Hu
Affiliation:
STEAG RTP Systems Inc., 4425 Fortran Dr., San Jose, CA 95134-2300
S.P. Tay
Affiliation:
STEAG RTP Systems Inc., 4425 Fortran Dr., San Jose, CA 95134-2300
Get access

Abstract

NiSi, with its low resistivity and wide processing window (350 - 750°C), is an attractive candidate for use as a gate contact material. In order to follow the interface reaction that leads to the formation of NiSi in real time, ellipsometry and atomic force microscopy (AFM) were used to study changes on the surface resulting from the reaction between Ni and Si for various times and temperatures, and Rutherford Backscattering spectrometry (RBS) to determine compositional changes in the forming silicides. We report that ellipsometry can be used to monitor the various Ni-Si phases forming in real time, and we have observed agglomeration of the silicide, which has been reported to occur at 1000°C, at temperatures, as low as 550°C for long time anneals.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Hu, Y. and Tay, S.P., J. Vac. Soc. Tech. A, 16 (3), p. 1,820 (1998).10.1116/1.581114Google Scholar
2 Nicolet, M.A. and Lau, S.S., in VLSI Electronics, Microstructure Science, edited by Enspruch, N.G. and Larrabee, G.B., Academic, New York (1983).Google Scholar
3 Amorsolo, A.V. Jr., Funkenbusch, P.D., and Kadin, A.M., J. Mater. Res., 11, p. 412 (1996).10.1557/JMR.1996.0050Google Scholar
4 Morimoto, T., Ohguro, T., Momose, H.S., Iinuma, T., Kunishima, I., Sguro, K., Katakabe, I., Nakajima, H., Tsuchiaki, M., Ono, M., Katsumata, Y., and Iwai, H., IEEE Trans. Electron Devices, 42, p. 915 (1995).10.1109/16.381988Google Scholar
5 Deng, F., Johnson, R.A., Asbeck, P.M., Lau, S.S., Dubbelday, W.B., Hsiao, T., and Woo, J., J. Appl. Phys., 81 (12), p.8,047 (1997).10.1063/1.365410Google Scholar
6 Chen, H.-W., and Lue, J.-T., J. Appl. Phys., 59 (6), p. 2,165 (1986).10.1063/1.337025Google Scholar
7 Jimenez, J.R., Wu, Z.-C., Schowalter, L.J., Hunt, B.D., Fathauer, R.W., Grunthaner, P.J., and Lin, T.L., J. Appl. Phys., 66 (6), p. 2,738 (1989).10.1063/1.344217Google Scholar
8 Tu, K.N., Alessandrini, E.I., Chu, W.K., H.Krautle, and Mayer, J.W., Jpn. J. Appl. Phys., Part 1 2, p. 669 (1974).10.7567/JJAPS.2S1.669Google Scholar