Hostname: page-component-cd9895bd7-p9bg8 Total loading time: 0 Render date: 2024-12-27T01:33:43.281Z Has data issue: false hasContentIssue false

In-Situ Observation of UV/Ozone Oxidation of Silicon using Spectroscopic Eli Psometry

Published online by Cambridge University Press:  10 February 2011

T. Saitoh
Affiliation:
Deparment ofElectrical and Electronics Engineering, Tokyo A&T University Koganei, Tokyo 184-8588, Japan
D. Kobayashi
Affiliation:
Deparment ofElectrical and Electronics Engineering, Tokyo A&T University Koganei, Tokyo 184-8588, Japan
D. Kimura
Affiliation:
Deparment ofElectrical and Electronics Engineering, Tokyo A&T University Koganei, Tokyo 184-8588, Japan
K. Asai
Affiliation:
Deparment ofElectrical and Electronics Engineering, Tokyo A&T University Koganei, Tokyo 184-8588, Japan
Get access

Abstract

Initial oxidation process of silicon in UV/ozone ambient has been monitored using a multi-wavelength, in-situ spectroscopic ellipsometry. Ozone gas was chemically formed by photochemical reaction of oxygen under ulUmviolet illuimination. The oxide growth was monitored for hydrogenated silicon surfaces as functions of oxygen gas flow rate, gas pressure and wafer temperature. Initial oxidation rates were very high at almost all the temperatures. The oxidation rate was 0.2 nm/min about ten times higher than that for thermal oxidation without UV light at low temperatures. The accelerated oxidation was probably due to an electric field effect on the oxidation of back-bond silicon by active oxygen atoms included in the ozone gas.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Azzam, R.M.A. and Baslwa, N. M., “Ellipsometry and Polarized Light”, North Holland Pub. Co., (1977)Google Scholar
2 Tbeeton, J. B., Hottier, F. and Hallais, J., Crystal, J. Growth 46, 245 (1979)Google Scholar
3 Aspnes, D. E., Thin Solid Films 233, 1 (1993)10.1016/0040-6090(93)90050-YGoogle Scholar
4 Collins, R. W., Rev. Sci. Instnum. 61, 2029 (1990)10.1063/1.1141417Google Scholar
5 Zettler, J.-T., Wethkamp, T., Zorn, M, Pristovsek, M, Meyne, C., Ploska, K. and Richter, W., Appl. Phys. Lett 67 3783 (1995)10.1063/1.115382Google Scholar
6 Chao, S. C., Pitchai, R. and Lee, Y. H., J. Electrochem. Soc. 136, 2751 (1989)10.1149/1.2097584Google Scholar
7 Kazor, A., Gwilian, R. and Boyd, I. W.: Appl. Phys. Lett 65, 412 (1994)10.1063/1.112318Google Scholar
8 Awaji, N., Okubo, S., Nakanishi, T., Sugita, Y., Takasaki, K. and Komiya, S.:Japan. J. Appl. Phys. 35, L67 (1996)10.1143/JJAP.35.L67Google Scholar
9 Jols, B., Doerr, D., Pitial, S., Bhat, I. B. and Dakshinamurthy, S.: Thin Solid Films 233,293 (1993)Google Scholar
10 JellisoN, G. E. Jr., and Modine, F. A.: J. Appl. Phys. 76 (6) 3758 (1994)10.1063/1.357378Google Scholar
11 Niwano, M., Kageyama, J., Kinashi, K. and Miyamoto, N.: J. Vac. Sci. Technol. A12 (2) 465 (1994)10.1116/1.579264Google Scholar
12 Cabrem, N. and Mott, N. F.: Rep. Progr. Phys. 12, 163 (1948)Google Scholar