Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-25T17:45:27.176Z Has data issue: false hasContentIssue false

In-Plane Permittivity of Spin-Cast Polymer Films

Published online by Cambridge University Press:  10 February 2011

Shari A. Weinberg
Affiliation:
Georgia Institute of Technology, Atlanta, GA.
Sue Ann Bidstrup-Allen
Affiliation:
Georgia Institute of Technology, Atlanta, GA.
Get access

Abstract

Polymeric materials such as polyimides are used in a multitude of microelectronic applications including interlevel dielectrics for insulation. Polyimide films have shown a difference between the through-plane and in-plane refractive index measurements.(1,2,3) This anisotropy in optical properties has been attributed to in-plane orientation of polymer chains and implies anisotropy in electrical properties. Thus, it is necessary to measure the electrical properties in both the in-plane and through-plane directions to accurately design three-dimensional electronic packages. The purpose of this research is to develop an in-situ technique to measure the in-plane permittivity of these spin-coated polymer films. Using capacitance measurements obtained from interdigitated electrodes, through-plane permittivity measurements, and ANSYS finite element analysis software, the in-plane permittivity of a given material can be determined. Several polyimide systems including Du Pont PI-2611 (BPDA-PPD), Du Pont PI-2540 (PMDA-ODA), and Probimide 293 (BTDA-DAPI) from OCG Microelectronics, as well as Cyclotene 3022 (BCB) from Dow Chemical were investigated. Anisotropy in the permittivity was observed in the three polyimide films, but not in the BCB film. Results were compared with predictions using refractive index measurements and a modified form of Maxwell's equation.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 L., Lin and Bidstrup, S.A., Journal of Applied Polymer Science 49, 12771289 (1993).Google Scholar
2 T.P., Russell, Gugger, H., Swalen, J.D., Journal of Polymer Science: Polymer Physics Edition 21, 17451756 (1983).Google Scholar
3 Takahashi, N., Yoon, D.Y., Parrish, W., Macromolecules 17 n 12, 25832588 (1984).Google Scholar
4 R.R., Tummala, Keyes, R.W., Grobman, W.D., Kapur, S., Microelectronics Packaging Handbook (Van Nostrand Reinhold, New York, 1989), pp. 673725.Google Scholar
5 Y., Inoue, Kobatake, Y., Kolloid-Zeitschrift 159 n. 1, p. 18 (1959).Google Scholar
6 P., Geldermans, Goldsmith, C., Bedetti, F., in Polyimides. Synthesis, Characterization, and Applications 2, edited by Mittal, K.L. (Plenum Press, New York, 1984), pp. 695711.Google Scholar
7 L., Lin, Ph.D. Thesis, Georgia Institute of Technology, 1994.Google Scholar
8 M.T., Pottiger, Coburn, J.C., Materials Science of High Temperature Polymers for Microelectronics 227 Nov., pp. 187194 (1991).Google Scholar
9 D., Boese, Lee, H., Yoon, D.Y., Swalen, J.D., Rabolt, J.F., Journal of Polymer Science, Part B: Polymer Physics 30, 13211327 (1992).Google Scholar
10 S.A., Weinberg, M.S. Thesis, Georgia Institute of Technology, 1996.Google Scholar
11 Product Literature for Benzocyclobutene, Dow Chemical Co., Microelectronic Polymers Division, Midland, MI.Google Scholar
12 Weber, W., OCG Microelectronics (private communication).Google Scholar
13 J.C., Coburn, Pottiger, M.T., Noe, S.C., Senturia, S.D., Journal of Polymer Science, Part B: Polymer Physics 32 n. 7, 12711283 (1994).Google Scholar
14 T.G, Tessier, Adema, G.M., Turlik, I., Proc. EIA/IEEE Electronic Components Conference, Houston 127 (1989).Google Scholar
15 Product Literature for PI-2540, Du Pont Company, Electronics Department, Wilmington, DE.Google Scholar