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Influence of the Cure Process on the Properties of Hydrogen Silsesquioxane Spin-On-Glass

Published online by Cambridge University Press:  15 February 2011

D. Többen ,
P. Weiganda ,
M.J. Shapiro  and
S.A. Cohen
D. Többen
Affiliation:
Siemens Components
P. Weiganda
Affiliation:
Siemens Components
M.J. Shapiro
Affiliation:
Siemens Components IBM Corporation present adress: SEMATECH, 2706 Montopolis Drive, Austin, TX 78741
S.A. Cohen
Affiliation:
IBM Corporation IBM T.J. Watson Research Center, P.O.Box 218, Route 134, Yorktown Heights, NY 10598
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Abstract

Hydrogen silsesquioxane spin-on-glass (SOG) is regarded as a potential low-k material for multilevel metallization (MLM) schemes. In this work we report on the properties of films which have been cured at different temperatures covering the range from 350°C to 850°C. It is found that the material remains in its microporous structures at the lower temperature while it can be strongly densified at increased thermal budgets. The slope of the dielectric constant indicates that care ought to be taken in subsequent metallization anneals in order to preserve the low-k values observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 443: Symposium H – Low-Dielectric Constant Materials II , 1996 , 195
Copyright
Copyright © Materials Research Society 1997

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