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Influence of Specimen Size and Sub-Micron Notch on The Fracture Behavior of Single Crystal Silicon Microelements and Nanoscopic Afm Damage Evaluation

Published online by Cambridge University Press:  10 February 2011

Kohji Minoshima ,
Shigemichi Inoue ,
Tomota Terada  and
Kenjiro Komai
Kohji Minoshima
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
Shigemichi Inoue
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
Tomota Terada
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
Kenjiro Komai
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
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Abstract

Simple bending tests of single-crystal silicon microelements fabricated by photoetching were performed. Silicon microelements deform elastically until final catastrophic failure, showing a brittle nature. The fracture strength increases with a decrease in specimen size, and the maximum strength reaches about 8 GPa. A Focused ion beam was used to machine a sub-µm deep notch. Such a small notch decreases the fracture strength of a microelement. Some fatigue tests were conducted in laboratory air and in distilled water: water reduces the strength of microelement under fatigue loading. Fracture surface and sample surface were closely examined with a scanning electron microscope and an atomic force microscope, and the fracture mechanisms are discussed from the nanoscopic points of view.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 546: Symposium AA – Materials Science of Microelectromechanical Systems (MEMS)… , 1998 , 15
Copyright
Copyright © Materials Research Society 1999

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