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Influence of Grain Orientation on the Microstructural Characterization in Cu During (self)-Anneal using a Surface Acoustic wave Technique

Published online by Cambridge University Press:  01 February 2011

Atsuko Sekiguchi ,
Kris Vanstreels ,
Steven DeMuynck ,
Jan D'Haen  and
Sywert H Brongersma
Atsuko Sekiguchi
Affiliation:
[email protected], Imec, SPDT/ITTO, Kapeldreef 75, Leuven, N/A, N/A, Belgium
Kris Vanstreels
Affiliation:
[email protected], IMO/Hasselt University, Diepenbeek, N/A, 3590, Belgium
Steven DeMuynck
Affiliation:
[email protected], Imec, Leuven, N/A, 3001, Belgium
Jan D'Haen
Affiliation:
[email protected], IMO/Hasselt University, Diepenbeek, N/A, 3590, Belgium
Sywert H Brongersma
Affiliation:
[email protected], Imec, Leuven, N/A, 3001, Belgium
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Abstract

This paper describes the influence of microstructure, or more specifically grain orientation and grain size, on the in-line monitoring of copper interconnect properties during (self)-anneal using surface acoustic wave spectroscopy (SAWS). In electroplated Cu after (self)-anneal the SAWS frequency is lower for samples annealed at higher temperature because of the lower porosity induced elasticity. In sputtered Cu, the SAWS frequency shows a clear correlation with grain size, which is induced by a strong re-orientation of the copper film from the as-deposited (111) texture (E=190 GPa) to a strongly (100) textured super grain structure (E=78GPa).

Keywords

Cuacousticmicrostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F06-09
Copyright
Copyright © Materials Research Society 2006

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