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In situ and Ex situ Measurements of Stress Evolution in the Cobalt-Silicon System

Published online by Cambridge University Press:  14 March 2011

G. Lucadamo
Affiliation:
Lehigh University, Dept. of Materials Science and Engineering, Bethlehem, PA 18015
C. Lavoie
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
C. Cabral Jr.
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
R. A. Carruthers
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
J.M.E. Harper
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
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Abstract

The biaxial stress in Co thin-films has been investigated in situ by measuring changes in substrate curvature that occurred during deposition and annealing.Films of Co, 35 to 500 nm in thickness, were deposited by UHV magnetron sputtering at room temperature on Si (100) and poly-Si substrates.Results show that during Co deposition the bending force increased linearly with film thickness; a signature of constant stress.In addition, the stress evolution during silicide formation was measured under constant heating rate conditions from room temperature up to 700°C. The stress-temperature curve was correlated with Co2Si, CoSi, and CoSi2 phase formation using in situ synchrotron X-ray diffraction measurements.The room temperature stress for the CoSi2 phase was found to be ∼0.8 GPa (tensile) in the films deposited on Si (100) and ∼1 GPa (tensile) on the films deposited on poly-Si.The higher tensile stress in the poly-Si sample could be a result of Si grain growth during annealing.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

[1] Agnello, P.D., Brodsky, S., Crabbe, E., Nowak, E., Lasky, J., and Davari, B., Electrochem. Soc. Proc., J1-Adv. in Rapid Thermal Processing May 2-6 1999.Google Scholar
[2] Steegen, A., DeWolf, I., and Maex, K., J. Appl. Phys., 86, 4290 (1999).Google Scholar
[3] d'Heurle, F.M., Inter. Mater. Rev. 34, 54 (1989).Google Scholar
[4] d'Heurle, F.M. and Thomas, O., Defect and Diffusion Forum 129–130, 137 (1996).Google Scholar
[5] Zhang, S.L., and d'Heurle, F.M., Thin Solid Films 213, 34 (1992).Google Scholar
[6] hove, L. Van den, Ph.D. Thesis, Katholicke Universiteit Leuven, B-3030 Leuven, Belgium (1988).Google Scholar
[7] Sitaram, A.R., Kalb, J.C., and Murarka, S.P., Mat. Res. Soc. Proc. Vol. 188, 67 (1990).Google Scholar
[8] Floro, J.A., Chason, E., and Lee, S.R., Mat. Res. Soc. Proc. Vol. 406, 491 (1996).Google Scholar
[9] k-Space Systems Inc., Ann Arbor MI.Google Scholar
[10] KLA-Tencor Inc., San Jose, CA.Google Scholar
[11] Stephenson, G.B., Ludwig, K.F., Jordan-Sweet, J.L., Brauer, S., Mainville, J., Yang, Y.S., and Sutton, M., Rev. Sci. Instrum. 60, 1537 (1989).Google Scholar
[12] Cabral, C. Jr., Clevenger, L.A., Harper, J.M.E., Roy, R.A., Saenger, K.L., Miles, G.L., and Mann, R.W., Mat. Res. Soc. Proc., Vol. 441, (1997).Google Scholar
[13] Zhang, S.-L., Lavoie, C., Cabral, C. Jr., Harper, J.M.E., d'Heurle, F.M., and Jordan-Sweet, J., J. Appl. Phys. 85, 2617 (1999).Google Scholar
[14] Koch, P., J. Phys. Condens. Matter. 6, 9519 (1994).Google Scholar
[15] Spaepen, F., Acta Mater, 48, 31 (2000).Google Scholar
[16] Cabral, C. Jr., Barmak, K., Gupta, J., Clevenger, L.A., Arcot, B., Smith, D.A., and Harper, J.M.E., J. Vac. Sci. Technol. A 11, 1435 (1993).Google Scholar
[17] Hong, Q.Z., d'Heurle, F. M., Harper, J.M.E., and Hong, S.Q., Appl. Phys. Lett. 62, 2637 (1993).Google Scholar
[18] Gurp, G.J. van, Weg, W.F. van der, and Sigurd, D., J. Appl. Phys. 49, 4011 (1978).Google Scholar
[19] d'Heurle, F.M. and Petersson, C.S., Thin Solid Films 128, 283 (1985).Google Scholar