Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-25T17:48:00.914Z Has data issue: false hasContentIssue false
  • English
  • Français

Impurities of Epoxy Novolac Resins and their Influence on the Reliability of Encapsulated Semiconductors.

Published online by Cambridge University Press:  25 February 2011

Shuichi Kanagawa  and
Yutaka Terada
Shuichi Kanagawa
Affiliation:
Sumitomo Chemical Co., Ltd, Osaka Research Laboratory, 1-98, 3-Chome, Kasugade-Naka, Konohana-ku, Osaka, Japan
Yutaka Terada
Affiliation:
Sumitomo Chemical Co., Ltd, Osaka Research Laboratory, 1-98, 3-Chome, Kasugade-Naka, Konohana-ku, Osaka, Japan
Get access

Abstract

Impurities, especially chemically bonded impurities, of o-cresol novolac epoxy resins and their influence on the moisture resistance and other properties of the epoxy molding compounds have been investigated to clarify the influence of impurities of epoxy resins on the reliability of encapsulated semiconductor. As a result, the existence of hydrolyzable chlorine and hydroxyl group-containing impurities has been confirmed, and it was found that the impurity such as a hydrolyzable chlorine causes undesirable influence on both the moisture resistance and electrical properties at high temperatures. It was also found that the impurity such as a hydroxyl group causes undesirable influence on the moisture resistance, and that the lower hydroxyl content gives the higher heat resistance as a result of an increase in the epoxy content.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 205
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Yoshizumi, A., Ikeya, H. and Suzuki, S., presented at the 38th Annual Conference, Reinforced Plastics/Composites Institute, The Society of the Plastics Industry, 1983.Google Scholar
2. Olberg, R.C., J. Electrochem. Soc., 118(1), 129 (1971).Google Scholar
3. Kolesar, S.C., presented at the 12th-Ainnual Reliability Physics Symposium, (1974).Google Scholar
4. Olberg, R.C. et al, Microelectronics and Reliability, 15, 601 (1976).Google Scholar
5. Harrison, J., Microelectronics and Reliability, 19, 233 (1977).Google Scholar
6. Tanaka, G., Suzuki, H. and Kubo, E., Denshi Zairyo, 18(1), 130 (1979).Google Scholar
7. Nakagawa, O. and Banjo, T., Plastics, 33(3), 63 (1982).Google Scholar
8. Lee, H. and Neville, K., Handbook of Epoxy Resins (McGraw-Hill, New York 1967), P.2–4.Google Scholar
9. For Example, Kanagawa, S. et al, Published unexamined Japanese Patent No.57–83520 (12 November 1982).Google Scholar
10. Sellers, R.F. and Smith, S.G., presented at the 27th Annual Technical Conference, Reinforced Plastics/Composites Institute, The Society of the Plastics Industry, 1972.Google Scholar