Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-25T15:52:12.227Z Has data issue: false hasContentIssue false

Importance of Surface Preparation in Direct Ion Beam Deposition(Ibd)

Published online by Cambridge University Press:  25 February 2011

Kiyoshi Miyake*
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., 2046 Kuji-cho, Hitachi-shi, Ibaraki 319-12, Japan
Get access

Abstract

Fundamental aspects of direct ion beam deposition (IBD) are discussed, stressing surface preparation and contamination problems. Residual gas contamination, ion beam induced metal contamination, and presence of surface native oxide before deposition are shown to be the major factors hindering low temperature epitaxial growth in IBD. A low energy hydrogen ion bombardment is demonstrated as an effective surface preparation method to remove surface native oxide in the case of silicon deposition.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 For example, Physics of Thin Films, Vol.13 (Ed. by Francombe, M.H. and Vossen, J.L., Academic Press, Inc., New York, 1987)Google Scholar
2 Miyake, K. and Tokuyama, T., “Direct Ion Beam Deposition” in Ion Beam Assisted Film Growth, (Ed. by Itoh, T., Elsevier, Amsterdam, 1989) pp. 289318.Google Scholar
3 Tokuyama, T., Yagi, K., Miyake, K., Tamura, M., Natsuaki, N. and Tachi, S., Nucl. Instrum. and Meth., 182/183, Part 1(1981) 241250.Google Scholar
4 Appleton, B.R., Pennycook, S.J., Zuhr, R.A., Herbots, N. and Noggle, T.S., Nucl. Instrum. and Methods in Phys. Res. B19/20(1987) 975982.Google Scholar
5 Zuhr, R.A., Appleton, B.R., Herbots, N., Larson, B.C., Noggle, T.S., and Pennycook, S. J., J. Vac. Sci. Technol., A5(1987) 21352139.Google Scholar
6 Armour, D.G., Mat. Res. Soc. Symp. Proc, Vol.100,(1987) 127137.Google Scholar
7 Chida, K., Kaneko, K. and Sakai, M., Mass Spectroscopy, 14(1969) 149156.Google Scholar
8 Fontell, A. and Arminen, E., Can. J. Phys., 47(21) (1969) 24052414.Google Scholar
9 Geerk, J. and Meyer, O., Surf. Sci., 32(1972) 222230.Google Scholar
10 Colligon, J.S., Grant, W.A., Williams, J.S. and Lawson, R.P.W., Proc. of Int. Conf. on Appl. of Ion Beams to Metals, Univ. of Warwick, 1975, Inst. Phys. Conf. Ser. No. 28, Chapter 9 (1976) 347-361.Google Scholar
11 Lawson, R.P.W., Freeman, J.H., Colligon, J.S., Grant, W.A., Nobes, M.J. and Williams, J.S., Nucl. Instrum. and Methods, 131(1975) 567568.Google Scholar
12 Freeman, J.H., Temple, W. and Gard, G.A., Nature 275(5681) (1978) 634635.Google Scholar
13 Amano, J. and Lawson, R.P.W., J. Vac. Sci. Technol. 14(2) (1977) 695698.Google Scholar
14 Tsukizoe, T., Nakai, T. and Ohmae, N., J. Appl. Phys., 48(11)(1977) 47704776.Google Scholar
15 Zalm, P.C. and Beckers, L.J., Appl. Phys. Letts., 41(1982) 167169.Google Scholar
16 Yagi, K., Tamura, S. and Tokuyama, T., Jpn. J. Appl. Phys., 16(2)(1977) 245251.Google Scholar
17 Miyake, K. and Tokuyama, T., Thin Solid Films, 92(1982) 123129.Google Scholar
18 Miyake, K., Yagi, K. and Tokuyama, T., Nucl. Instrum. and Methods 198 (1982) 535538.Google Scholar
19 Herbots, N., Appleton, B.R., Noggle, T.S., Zuhr, R.A. and Pennycook, S.J., Nucl. Instrum. and Methods, B13(1986) 250.Google Scholar
20 Armour, D.G., Bailey, P., Judge, P.A., Sharpies, G., Byers, P. and Whitehead, D., in : Takagi, T. (Ed.), Proc. 9th Symp. on ISIAT'85, Tokyo(1985) 181190.Google Scholar
21 Shimizu, S., Tsukakoshi, O., Komiya, S. and Makita, Y., J. Vac. Sci. Technol., B3(1985) 554559.Google Scholar
22 Maruno, S., Morishita, Y., Isu, T., Nomura, Y. and Ogata, H., J. of Crystal Growth, 81(1987) 338343.Google Scholar
23 Miyazawa, T., Misawa, S., Yoshida, S. and Gonda, S., J. Appl. Phys., 55(1) (1984) 188193.Google Scholar
24 Ishikawa, J., Takeiri, Y., Ogawa, K. and Takagi, T., J. Appl. Phys., 61(7) (1987) 25092515.Google Scholar
25 Kasi, S., Kang, H. and Rabalais, J.W., Phys. Rev. Letts., 59(1) 7578.Google Scholar
26 Yoshida, Y., Onishi, T., Sekihara, T. and Hirofuji, Y., Jpn. J. Appl. Phys., 27(1988)pp.140143.Google Scholar
27 Haynes, T.E., Zuhr, R.A., Pennycook, S.J. and Larson, B.C., Proc. 12th Symp. on ISIAT'89, Tokyo(1989) 363372.Google Scholar
28 Zuhr, R.A., Pennycook, S.J., Noggle, T.S., Herbots, N., Haynes, T.E. and Appleton, B.R., Nucl. Instrum. and Methods in Phys. Res. B37(1989) 1621.Google Scholar
29 Tachi, S., Miyake, K. and Tokuyama, T., Jpn. J. Appl. Phys., 21(1982) Suppl. 21-1, 141146.Google Scholar
30 Miyake, K., Jpn. J. Appl. Phys., 28(1989) 23762381.Google Scholar
31 Chang, C.C., in “Characterization of Solid Surfaces”, (ed. by Kane, P.F. and Larrabee, G.B., Plenum Press, New York, 1974), Chap. 20.Google Scholar
32 Andersen, H.H. and Bay, H.L., in “Sputtering by Particle Bombardment I”, (ed. by Behrisch, R., Springer, Heidelberg, 1981) p. 169.Google Scholar
33 Roth, J., in “Sputtering by Particle Bombardment II”,(ed. by Behrisch, R., Springer, Heidelberg, 1983) p.121.Google Scholar