Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-27T02:34:21.308Z Has data issue: false hasContentIssue false

Implications of Surface Contaminants in a Bpsg Deposition and Reflow Process

Published online by Cambridge University Press:  21 February 2011

M. Moinpour
Affiliation:
Intel Corporation, California Technology Development, Santa Clara, CA., 95052
R. Leitch
Affiliation:
Intel Corporation, California Technology Development, Santa Clara, CA., 95052
J. Li
Affiliation:
Intel Corporation, California Technology Development, Santa Clara, CA., 95052
D. Thach
Affiliation:
Intel Corporation, California Technology Development, Santa Clara, CA., 95052
F. Moghadam
Affiliation:
Intel Corporation, California Technology Development, Santa Clara, CA., 95052
Get access

Abstract

Chemically vapor deposited borophosphosilicate glass (BPSG) has been widely used in microelectronic device fabrication as interlayer dielectric film due to its excellent planarization, gettering and flow properties. A BPSG reflow step, performed either in a diffusion furnace or a RTP reactor, normally follows the deposition step. With device geometry reducing to sub micron levels, there is an increasingly greater emphasis on detection and elimination of surface contaminants and sub micron defects particularly on deposited film. In this paper, we report on the implications of surface contaminants in a BPSG deposition/reflow process. The deposition and reflow processes have been carried out in an atmospheric-pressure CVD system and a vertical diffusion furnace respectively. Ellipsometric measurements, SIMS, TXRF, and vapor phase dissolution (VPD) methods have been used to detect both metallic and non-metallic contaminants as a function of both BPSG deposition and furnace reflow process parameters. It was found that surface contaminants emanating under specific deposition conditions can cause an uncontrolled, enhanced oxidation during the reflow process. Process modifications and in line defect monitoring schemes are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Kern, W. and Smeltzer, R., Solid State Technology, Vol. 28, No. 6, pp. 171179, 1985 Google Scholar
2. Kern, W. and Schnable, G. L., RCA Rev. Vol. 43, pp. 423437, 1982 Google Scholar
3. Yano, K., Terai, Y., Imai, S., Ueda, T., Ueda, S., Endoh, M. and Nomura, N., Extended Abstracts of the 1992 International Conference on Solid State Devices and Materials, pp. 105107, 1992 Google Scholar
4. Ahmed, K. and Geisert, C., J. Vac. Sci. Technol., Vol. 10, No. 2, pp. 313315, 1992 CrossRefGoogle Scholar
5. Kern, W. and Kurylo, W. A., RCA Rev., Vol. 46, pp. 117126, 1985 Google Scholar
6. Coniff, J., Krott, L., Shenasa, M. and Woessner, S., To be presented at the 183rd meeting of the Electrochemical Society, Honolulu, Hawaii, May 16-21, 1993 Google Scholar
7. Shenasa, M., Coniff, J. and Kudla, J.P., ibid Google Scholar
8. Hub, W. and Penka, V., Microcontamination Conf. Proc., pp. 266272, 1991 Google Scholar
9. Gupta, P., Microcontamination Conf. proc., pp. 580587, 1992 Google Scholar