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Implanted 3D Micro/Nano-Structure Fabrication: New Processing Techniques for the Creation of Nanoscale Opto-Mechanical Machines in Silicon Dioxide on a Silicon wafer

Published online by Cambridge University Press:  15 March 2011

Meg Abraham
Meg Abraham*
Affiliation:
The Aerospace Corporation El Segundo, CA 90245
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Abstract

A novel method of making nanoscale devices in silicon dioxide on a silicon wafer has been developed in our laboratory. The method is both inexpensive and can be fully integrated with existing VLSI type electronic processing technology. The devices are defined using conventional micronscale photolithography and then reduced in scale during the processing sequence to form nanoscale structures. Further, since the structures are defined using lithography, they can be made to span the range of scales from macro to nano in one processing step. Finally, we have found that by using laser assisted chemical etches, we can “release” these very fine structures without the damage associated with wet processes such as stiction.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 820: Symposia O/R – Nanoengineered Assemblies and Advanced Micro/Nanosystems , 2004 , R1.4
Copyright
Copyright © Materials Research Society 2004

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References

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