Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Ozturk, M.C.
Sorrell, F.Y.
Wortman, J.J.
Johnson, F.S.
and
Grider, D.T.
1991.
Manufacturability issues in rapid thermal chemical vapor deposition.
IEEE Transactions on Semiconductor Manufacturing,
Vol. 4,
Issue. 2,
p.
155.
Maex, Karen
1991.
Rapid thermal processing and thin film technologies.
Microelectronic Engineering,
Vol. 15,
Issue. 1-4,
p.
467.
Öztürk, Mehmet C.
Sanganeria, Mahesh K.
and
Sorrell, F. Yates
1992.
A uniformity degradation mechanism in rapid thermal chemical vapor deposition.
Applied Physics Letters,
Vol. 61,
Issue. 22,
p.
2697.
Sorrell, F.Y.
Fordham, M.J.
Ozturk, M.C.
and
Wortman, J.J.
1992.
Temperature uniformity in RTP furnaces.
IEEE Transactions on Electron Devices,
Vol. 39,
Issue. 1,
p.
75.
Osburn, C.M.
1993.
Rapid Thermal Processing.
p.
227.
Roozeboom, Fred
1993.
Rapid Thermal Processing.
p.
349.
Cho, Y.M.
and
Kailath, T.
1993.
Model identification in rapid thermal processing systems.
IEEE Transactions on Semiconductor Manufacturing,
Vol. 6,
Issue. 3,
p.
233.
Sanganeria, Mahesh K.
and
ÖztÖrk, Mehmet C.
1993.
Application of Constant Absorptivity Ring (Car) to Improve Polysilicon Thickness Uniformity In A Rapid Thermal Chemical Vapor Deposition Reactor.
MRS Proceedings,
Vol. 303,
Issue. ,
Dilhac, J.-M.
Nolhier, N.
and
Ganibal, C.
1993.
Physical modelling for uniformity control of rapid thermal processes.
p.
7.
Cho, Y.M.
Paulraj, A.
Kailath, T.
and
Guanghan Xu
1994.
A contribution to optimal lamp design in rapid thermal processing.
IEEE Transactions on Semiconductor Manufacturing,
Vol. 7,
Issue. 1,
p.
34.
Sorrell, F.Y.
Fordham, M.J.
Yu, Seungil
and
Neto, A.J. Silva
1994.
RTP Modeling for CVD and Thermal Oxidation.
MRS Proceedings,
Vol. 342,
Issue. ,
Hebb, Jeffrey P.
Jensen, Klavs F.
and
Egan, Erik W.
1995.
The Potential Effect of Multilayer Patterns on Temperature Uniformity During Rapid Thermal Processing.
MRS Proceedings,
Vol. 389,
Issue. ,
Dilhac, J.
Nolhier, N.
Ganibal, C.
and
Zanchi, C.
1995.
Thermal modeling of a wafer in a rapid thermal processor.
IEEE Transactions on Semiconductor Manufacturing,
Vol. 8,
Issue. 4,
p.
432.
Hebb, Jeffrey P.
Jensen, Klavs F.
and
Egan, Erik W.
1995.
The Potential Effect of Multilayer Patterns on Temperature Uniformity During Rapid Thermal Processing.
MRS Proceedings,
Vol. 387,
Issue. ,
Maex, K.
1996.
Advances in Rapid Thermal and Integrated Processing.
p.
333.
Knutson, Karson L.
and
Cooper, Thomas L.
1996.
Response Surface Technique forEx SituProcess Uniformity Optimization in a Multi-Zone RTP System.
MRS Proceedings,
Vol. 429,
Issue. ,
Timans, P. J.
1996.
Advances in Rapid Thermal and Integrated Processing.
p.
35.
Roozeboom, Fred
1996.
Advances in Rapid Thermal and Integrated Processing.
p.
1.
Jensen, K. F.
Merchant, T. P.
Cole, J. V.
Hebb, J. P.
Knutson, K. L.
and
Mihopoulos, T. G.
1996.
Advances in Rapid Thermal and Integrated Processing.
p.
265.
Speranza, Tony
Riley, Terry
Nanda, Arun
Fowler, Burt
Torres, Kenneth
Geyling, Franz
and
Lindholm, Don
1996.
Commercial RTP-A SEMATECH Perspective.
MRS Proceedings,
Vol. 429,
Issue. ,