Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-23T14:31:07.827Z Has data issue: false hasContentIssue false

Impact Ionization in Ion Implanted 4H-SiC Photodiodes

Published online by Cambridge University Press:  01 February 2011

Wei Sun Loh
Affiliation:
[email protected], the University of Sheffield, Electronic and Electrical Engineering, Mappin Street, S1 3JD, Sheffield, S1 3JD, United Kingdom, 01142225890
Eric Z. J. Goh
Affiliation:
[email protected], the University of Sheffield, Electronic and Electrical Engineering, Mappin Street, Sheffield, S1 3JD, United Kingdom
Konstantin Vassilevski
Affiliation:
[email protected], Newcastle University, School of Electrical, Electronic and Computer Engineering, Newcastle, NE1 7RU, United Kingdom
Irina Nikitina
Affiliation:
[email protected], Newcastle University, School of Electrical, Electronic and Computer Engineering, Newcastle, NE1 7RU, United Kingdom
John P. R. David
Affiliation:
[email protected], the University of Sheffield, Electronic and Electrical Engineering, Mappin Street, Sheffield, S1 3JD, United Kingdom
Nick G Wright
Affiliation:
[email protected], Newcastle University, School of Electrical, Electronic and Computer Engineering, Newcastle, NE1 7RU, United Kingdom
C Mark Johnson
Affiliation:
[email protected], the University of Nottingham, School of Electrical and Electronic Engineering, University Park, Nottingham, NG7 2RD, United Kingdom
Get access

Abstract

Hole dominated avalanche multiplication and thus breakdown characteristics of ion implanted 4H-SiC p+-n-n+ photodiodes were determined by means of photomultiplication measurements using 325 nm UV light. All the tested diodes exhibited low reverse leakage current and reasonably uniform avalanche breakdown. With avalanche widths of 0.2 µm to 1.5 µm and the capability to measure multiplication factor as low as 1.001, the room temperature impact ionization coefficients were precisely deduced from these 4H-SiC diodes using a local ionization model for electric fields ranging from 1.25 MV/cm to 2.8 MV/cm. The results agree with those reported by Ng et al. and are within the accuracy of both the C-V measurements and electric-field determinations.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Elasser, A. and Chow, T. P., “Silicon carbide benefits and advantages for power electronics circuits and systems,” Proceedings of the IEEE, vol. 90, pp. 969986, 2002.Google Scholar
lsqb;2] Neudeck, P. G., Okojie, R. S., and Chen, L. Y., “High-Temperature Electronics–A Role for Wide Bandgap Semiconductors?” vol. 90: Institute of Electrical and Electronics Engineers, 2002, pp. 10651076.Google Scholar
[3] Weitzel, C. E., Palmour, J. W., Carter, C. H. Jr., Moore, K., Nordquist, K. K., Allen, S., Thero, C., and Bhatnagar, M., “Silicon carbide high-power devices,” Electron Devices, IEEE Transactions on, vol. 43, pp. 17321741, 1996.Google Scholar
[4] Werner, M. R. and Fahrner, W. R., “Review on materials, microsensors, systems and devices for high-temperature and harsh-environment applications,” Industrial Electronics, IEEE Transactions on, vol. 48, pp. 249257, 2001.Google Scholar
[5] Baliga, B. J., Power semiconductor devices: PWS Pub. Co., 1996.Google Scholar
[6] Brown, D. M., Downey, E. T., Ghezzo, M., Kretchmer, J. W., Saia, R. J., Liu, Y. S., Edmond, J. A., Gati, G., Pimbley, J. M., and Schneider, W. E., “Silicon carbide UV photodiodes,” Electron Devices, IEEE Transactions on, vol. 40, pp. 325, 1993.Google Scholar
[7] Feng, Y., Xiaobin, X., Aslam, S., Zhao, Yuegang, Franz, D., Zhao, J. H., and Weiner, M., “4H-SiC UV photo detectors with large area and very high specific detectivity,” Quantum Electronics, IEEE Journal of, vol. 40, pp. 1315, 2004.Google Scholar
[8] Hatakeyama, T., Watanabe, T., Shinohe, T., Kojima, K., Arai, K., and Sano, N., “Impact ionization coefficients of 4H silicon carbide,” Applied Physics Letters, vol. 85, pp. 13801382, 2004.Google Scholar
[9] Konstantinov, A. O., Wahab, Q., Nordell, N., and Lindefelt, U., “Ionization rates and critical fields in 4H silicon carbide,” Appl. Phys. Lett., vol. 71, pp. 9092, 1997.Google Scholar
[10] Ng, B. K., David, J. P. R., Tozer, R. C., Rees, G. J., Yan, F., Zhao, J. H., and Weiner, M., “Nonlocal effects in thin 4H-SiC UV avalanche photodiodes,” IEEE Trans. on Electron Devices, vol. 50, pp. 17241732, 2003.Google Scholar
[11] Raghunathan, R. and Baliga, B. J., “Temperature dependence of hole impact ionization coefficients in 4H and 6H-SiC,” Sol. State Electron., vol. 43, pp. 199211, 1999.Google Scholar
[12] Woods, M. H., Johnson, W. C., and Lampert, M. A., “Use of a Schottky barrier to measure impact ionization coefficients in semiconductors,” Solid State Electron, vol. 16, pp. 381384, 1973.Google Scholar
[13] Sze, S. M., Physics of Semiconductor Devices, 2nd ed: John Wiley and Sons, 1981.Google Scholar
[14] Sridhara, S. G., Devaty, R. P., and Choyke, W. J., “Absorption coefficient of 4H silicon carbide from 3900 to 3250 Å,” J. of Appl. Phys., vol. 84, pp. 2963, 1998.Google Scholar