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Hot Embossing Of Microchannels in Cyclic Olefin Copolymers

Published online by Cambridge University Press:  31 January 2011

Patrick William Leech
Patrick William Leech*
Affiliation:
[email protected], CSIRO, Gate 5 Normanby Rd, Clayton, 3169, Clayton, Victoria, 3169, Australia
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Abstract

The hot embossing properties of Cyclic Olefin Copolymer (COC) have been examined as a function of comonomer content. Six standard grades of COC with varying norbornene content (61-82 wt%) were used in these experiments in order to provide a range of glass transition temperatures, Tg. All grades of COC exhibited sharp increases in embossed depth over a critical range of temperature. The transition temperature in embossed depth increased linearly with norbornene content for both 35 and 70 μm deep structures. At temperatures above this transition, the dimensions of the embossed patterns were essentially independent of COC grade, the applied pressure and duration of loading. Channels formed above the transition in a regime of viscous liquid flow were extremely smooth in morphology for all grades. The average surface roughness, Ra, measured at the base of the channels decreased sharply at the transition temperature, with a levelling off at higher temperatures. Grades of COC with higher norbornene content exhibited extensive micro-cracking during embossing at temperatures close to the transition temperature.

Keywords

hot pressingfluidicspolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1191: Symposium OO – Materials and Strategies for Lab-on-a-Chip–Biological Analysis, Cell-Material Interfaces and Fluidic Assembly of Nanostructures , 2009 , 1191-OO03-01
Copyright
Copyright © Materials Research Society 2009

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References

1 Heckele, M. and Schomburg, W.K. J. Micromech. Microeng. 14, R1 (2004). 10.1088/0960-1317/14/3/R01Google Scholar
2 Huanga, W.J. Changa, F.C. and Chu, P.P.J. Polym. J. 41, 6095 (2000).10.1016/S0032-3861(99)00842-3Google Scholar
3 Forsyth, J.F. Scrivani, T. Benavente, R. Marestin, C. and Perena, J.M. J. Appl. Polymer Sci. 82, 2159 (2001).10.1002/app.2063Google Scholar
4 Seydewitz, V. Krumova, M. Michler, G.H. Park, J.Y. and Kim, S.C. Polymer 46, 5608 (2005).10.1016/j.polymer.2005.05.029Google Scholar
5 Cameron, N.S. Roberge, H. Veres, T. Jakeway, S.C. and Crabtree, H.J. Lab Chip 6, 936 (2006).10.1039/b600584eGoogle Scholar
6 Steigert, J. Haeberle, S. Brenner, T. Müller, C., Steinert, C.P. Koltay, P. Gottschlich, N. Reinecke, H. Rühe, J., Zengerle, R. and Ducré, J., J. Microm.Microeng. 17, 333 (2007).10.1088/0960-1317/17/2/020Google Scholar
7 Mair, D.A. Geiger, E. Pisano, A.P. Fréchet, J.M.J. and Svec, F. Lab Chip 6, 1346 (2006).10.1039/B605911BGoogle Scholar
8 Scrivani, T. Benaventure, R. Perez, E. and Perena, J.M. Macromol.Chem.Phys. 202, 2547 (2001).10.1002/1521-3935(20010801)202:12<2547::AID-MACP2547>3.0.CO;2-X3.0.CO;2-X>Google Scholar
9 Guo, L.J. J.Phys D: Appl.Phys. 37, R123 (2004).10.1088/0022-3727/37/11/R01Google Scholar
10 Shan, X. Liu, Y.C. and Lam, Y.C. Microsyst.Technol. 14, 1055 (2008).10.1007/s00542-007-0486-yGoogle Scholar