Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-25T18:01:18.219Z Has data issue: false hasContentIssue false
  • English
  • Français

Homogeneous Al-Ti and Al-Ti-Si Thin Alloy Films

Published online by Cambridge University Press:  26 February 2011

Albertus G. Dirks ,
Tien Tien  and
Janet M. Towner
Albertus G. Dirks
Affiliation:
Philips Research Laboratories Sunnyvale, Signetics Corporation, 811 E. Arques Avenue, Sunnyvale, CA 94088–3409
Tien Tien
Affiliation:
Philips Research Laboratories Sunnyvale, Signetics Corporation, 811 E. Arques Avenue, Sunnyvale, CA 94088–3409
Janet M. Towner
Affiliation:
Philips Research Laboratories Sunnyvale, Signetics Corporation, 811 E. Arques Avenue, Sunnyvale, CA 94088–3409
Get access

Abstract

The microstructure and properties of thin films depends strongly upon the alloy composition. A study was made of the metallurgical aspects of homogeneous Al alloy films, particularly the binary Al-Ti and the ternary Al-Ti-Si systems. Electrical resistivity, grain size morphology, second phase formation and electromigration have been studied as a function of the alloy composition and its heat treatment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 54: Symposium E – Thin Films–Interfaces and Phenomena , 1985 , 181
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Learn, A.J., J. of Electronic Mat. 3, 531 (1974).Google Scholar
2. d'Heurle, F.M., Met. Trans. 2, 683 (1971).Google Scholar
3. Fischer, F., Siemens Forsch. & Entwicklber, 13, 21 (1984).Google Scholar
4. Proceedings of Second International IEEE VLSI Multilevel Interconnection Conference, Santa Clara, California, June 1985.Google Scholar
5. Gardner, D.S., Beyers, R.B., Michalka, T.L., Saraswat, K.C., Barbee, T.W., and Meindl, J.D., Proceedings of International Electron Devices Meeting, San Francisco, California, Dec. 1984, p. 114.Google Scholar
6. Dirks, A.G., Tien, T., and Towner, J.M. (submitted for publication in J. Appl. Phys.).Google Scholar
7. van den Broek, J.J., Dirks, A.G., and Wierenga, P.E., Thin Solid Films 129, 000 (1985).Google Scholar
8. Wierenga, P.E., Dirks, A.G., and van den Broek, J.J., Thin Solid Films 119, 375 (1984).Google Scholar
9. Hansen, M., Constitution of Binary Alloys, 2nd ed. (McGraw-Hill book comp., New York, 1958), p. 139.Google Scholar
10. Schob, V.O., Nowotny, H., and Benesovsky, F., Planseeberichte 10, 65 (1962).Google Scholar
11. Howard, J.K., White, J.F., and Ho, P.S., J. Appl. Phys. 49, 4083 (1978).Google Scholar
12. Towner, J.M., Solid State Tech. 27 (10), 197 (1984).Google Scholar