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High-Temperature Dielectric Polyimide Films for Energy Storage Applications

Published online by Cambridge University Press:  06 June 2013

David H. Wang ,
Brian A. Kurish ,
Imre Treufeld ,
Lianyun Yang ,
Lei Zhu  and
Loon-Seng Tan
David H. Wang
Affiliation:
Materials & Manufacturing Directorate, Soft-Matter Materials Branch (AFRL/RXAS), Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio 45433-7750 UES Inc., Dayton OH, 45432
Brian A. Kurish
Affiliation:
Materials & Manufacturing Directorate, Soft-Matter Materials Branch (AFRL/RXAS), Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio 45433-7750 UES Inc., Dayton OH, 45432
Imre Treufeld
Affiliation:
Department of Macromolecular Science and Engineering, Case Western Reserve University, Cleveland, OH 44106
Lianyun Yang
Affiliation:
Department of Macromolecular Science and Engineering, Case Western Reserve University, Cleveland, OH 44106
Lei Zhu
Affiliation:
Department of Macromolecular Science and Engineering, Case Western Reserve University, Cleveland, OH 44106
Loon-Seng Tan*
Affiliation:
Materials & Manufacturing Directorate, Soft-Matter Materials Branch (AFRL/RXAS), Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio 45433-7750
*
*Email: [email protected]
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Abstract

Two new diamines containing three nitriles are synthesized via a 3-step route. They are polymerized with four commercial dianhydrides (i.e. 6FDA, OPDA, BTDA and PMDA) in N,N-dimethylacetamide (DMAc) to afford poly(amic acid)s, which are thermally cured at temperatures up to 300 °C to form tough, creasable films. Most of these polyimides are soluble in common solvents. Their glass transition temperatures range from 216 to 341 °C. The polyimides are stable up to 400 °C. The dielectric constants of these OPDA-based polyimides increase from 2.9 (CP2) to 4.7 as measured by the D-E loops.

Keywords

dielectricpolymerenergy storage
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1541: Symposium F – Materials for Vehicular and Grid Energy Storage , 2013 , mrss13-1541-f05-11
Copyright
Copyright © Materials Research Society 2013 

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References

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