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High-Rate Etching of Mn-Zn Ferrite by Laser-Induced Chemical Reaction in CC12F2 Atmosphere

Published online by Cambridge University Press:  26 February 2011

Y. F. Lu
Affiliation:
Faculty of Engineering Science and Research Center for Extreme Materials, Osaka University, Toyonaka, Osaka 560, Japan
M. Takai
Affiliation:
Faculty of Engineering Science and Research Center for Extreme Materials, Osaka University, Toyonaka, Osaka 560, Japan
S. Nagatomo
Affiliation:
On leave from D. S. Scanner Co., Ltd., Fukushima 5–3–7, Fukushima-ku, Osaka 553, Japan
S. Namba
Affiliation:
Faculty of Engineering Science and Research Center for Extreme Materials, Osaka University, Toyonaka, Osaka 560, Japan
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Abstract

Maskless dry etching of Mn-Zn ferrite in dich1orodif1uoromethane (CC12F2) by Ar+-ion laser (514.5 nm-line) irradiation has been investigated to obtain high etching rates and aspect-ratios of etched grooves. The etching reaction was found to be thermochemical and caused by Cl radicals thermally decomposed from CCl2F2 gas. High etching rates of up to 360 μm/s, which is about one order of magnitude higher than that in a CCl4 gas and even higher than that in a H3PO4 solution, have been achieved. A high aspect-ratio of up to 12 was obtained. Definite gas pressure and dwell time are necessary to fabricate a smooth groove.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

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References

1. Laser Diagnostics and Photochemical Processing for Semiconductors, ed by Osgood, R.M. Jr., Brueck, S.R.J., Schlossberg, H.R. (North-Holland, New York, 1983)Google Scholar
2. Laser-Controlled Chemical Processing of Surfaces, ed. by Johnson, A.W., Ehrlich, D.J., Schlossberg, H.R. (North-Holland, New York, 1984)Google Scholar
3. Laser Processing and Diagnostics, ed. by Bauerle, D. (Springer, Berlin, Heidelberg, 1984)Google Scholar
4. Laser Microfabrication - Thin Film Processes and Lithoqraphy, ed. by Ehrlich, D.J. and Tsao, J.Y. (Academic Press Inc. San Diego, London, 1989)Google Scholar
5. Takai, M., Nagatomo, S., Koizumi, T., Lu, Y.F., Gamo, K., and Namba, S.: Laser Processi nq and Pi agnostics(II), ed. by Bauerle, D., Kompa, K.L. and Lande, L. (Les Editions de Phys., Cedex, 1986) p. 57 Google Scholar
6. Takai, M., Lu, Y.F., Koizumi, T., Nagatomo, S. and Namba, S.: Appl. Phys. A46, 197 (1988)Google Scholar
7. Lu, Y.F., Takai, M., Nagatomo, S., and Namba, S.: Appl. Phys. A47, 319 (1988)Google Scholar
8. Lu, Y.F., Takai, M., Nagatomo, S., Minamisono, T., and Namba, S.: Jpn. J. Appl. Phys. 28, 2151 (1989)Google Scholar
9. Lu, Y.F., Takai, M., Kinomura, A., Sanda, H., and Namba, S.: submitted to Lasers in Materials EngineeringGoogle Scholar
10. CCl2F2: DFG MAK: 1000 ppm (4950 mg/m3); CC14: DFG MAK: 10 ppm (65 mg/m3). referenced from Hazardous Chemicals Desk Reference: ed. by Sax, N.I., Lewis, R.J. Sr., (Van Nostrond Reinhold, New York, Tokyo, 1987), Japanese Edition p.260 & p. 247Google Scholar
11. Comprehensive Inorganic Chemistry, Vol. 2, ed. by Bailar, J.C. Jr., Emeleus, H.J., Nyholm, R., and Trotman-Dikenson, A.F. (Pergamon Press, Oxford, New York, 1973) p. 1258 Google Scholar
12. Tokuda, J., Takai, M., Gamo, K. and Namba, S.: Inst. Phys. Conf. Ser. 79, 319 (1986)Google Scholar
13. Takai, M., Tokuda, J., Nakai, N., Gamo, K., and Namba, S.: Jpn. J. Appl. Phys. 22, L757 (1983)Google Scholar