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High Tg, Low Dielectric Constant Aromatic Benzoxazoles Containing Allylether Pendent Groups for Use in Microelectronic Packaging

Published online by Cambridge University Press:  21 March 2011

Max D. Alexander Jr. ,
Thuy D. Dang ,
Christina E. Specker ,
Marlene Houtz ,
R.J. Spry  and
Fred E. Arnold
Max D. Alexander Jr.
Affiliation:
Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio 45433-7750, U.S.A
Thuy D. Dang
Affiliation:
Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio 45433-7750, U.S.A
Christina E. Specker
Affiliation:
Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio 45433-7750, U.S.A
Marlene Houtz
Affiliation:
Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio 45433-7750, U.S.A
R.J. Spry
Affiliation:
Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio 45433-7750, U.S.A
Fred E. Arnold
Affiliation:
Polymer Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory Wright-Patterson Air Force Base, Ohio 45433-7750, U.S.A
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Abstract

Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400°C), high glass transition temperature (greater than 350°C), low water uptake (less than one percent), solubility in selected organic solvents, and low thermal expansion are all required. We have successfully synthesized and characterized several candidate polymers in an effort to address these needs.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N6.6
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Dang, T.D., Mather, P.T., Alexander, M.D. Jr., Grayson, C.J., Houtz, M.D., Spry, R.J., Arnold, F.E., J Poly. Sci. Part A: Poly Chem, 38 1991 (2000)Google Scholar
2. Dang, Thuy, Hudson, Leslie S., Feld, William A., and Arnold, Fred E., Polymer Preprints 41(1), 103 (2000)Google Scholar