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High Temperature Clay Filled Epoxy Composites

Published online by Cambridge University Press:  26 February 2011

Dharmaraj Raghavan ,
Joseph Ktoo Langat ,
Mauro Zammarano  and
Jeffrey Gilman
Dharmaraj Raghavan
Affiliation:
[email protected], Howard, Chemistry, 525 College Street, NW, Washington DC, DC, 20059, United States
Joseph Ktoo Langat
Affiliation:
[email protected], Howard University, Department of Chemistry, 525 College Street, Washington, DC, 20059, United States
Mauro Zammarano
Affiliation:
[email protected], National Institute of Standards and Technology, Gaithersburg, MD, 20899, United States
Jeffrey Gilman
Affiliation:
[email protected], National Institute of Standards and Technology, Gaithersburg, MD, 20899, United States
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Abstract

The primary objective of this study is to improve the thermal stability of clay and clay filled composite. An epoxy-clay composite has been prepared by dispersing 1-hexadecyl-3-(6-hydroxyhexyl)-2-methylimidazolium modified clay in an epoxy resin and cured with metaphenylene diamine (m-PDA) at 110.0 °C for 7 h and post cured at 140°C for 4 h. The thermal stability of the modified clay and clay filled epoxy composite was characterized via thermogravimetric analysis (TGA). The onset decomposition temperature of the imidazolium functionalized clay was 360°C. Transmission Electron Microscopy (TEM) of the composite showed mixed morphology with predominant fraction of intercalated clay platelets in the epoxy matrix. The onset decomposition temperature of the modified clay filled epoxy composite was found to be higher than that of pristine epoxy.

Keywords

compositethermogravimetric analysis (TGA)morphology
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 977: Symposium FF – Processing-Structure-Mechanical Property Relations in Composite Materials , 2006 , 977-FF12-20
Copyright
Copyright © Materials Research Society 2007

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