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High Performance 0.5 and 0.25 μm Gate GaAs Mesfet Grown by MOCVD Using Tertiarybutylarsine

Published online by Cambridge University Press:  25 February 2011

V.S. Sundaram
Affiliation:
High Technology Center, Boeing Aerospace and Electronics Seattle, Washington : 98124
B.-Y. Mao
Affiliation:
High Technology Center, Boeing Aerospace and Electronics Seattle, Washington : 98124
S.J. Zurek
Affiliation:
High Technology Center, Boeing Aerospace and Electronics Seattle, Washington : 98124
H.M. Levy
Affiliation:
High Technology Center, Boeing Aerospace and Electronics Seattle, Washington : 98124
G.Y. Lee
Affiliation:
High Technology Center, Boeing Aerospace and Electronics Seattle, Washington : 98124
L.M. Fraas
Affiliation:
High Technology Center, Boeing Aerospace and Electronics Seattle, Washington : 98124
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Abstract

Using tertiarybutylarsine and trimethylgallium a GaAs MESFET structure was grown and fabricated into half and quarter micron devices. The typical transconductance and unity current gain frequency (ft) for the half micron device were 360 mS/mm and 24 GHZ respectvely. The corresponding numbers for the quarter micron devices were 510 mS/mm and 55 GHZ respectively.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. Stringfellow, G.B., J. Electron. Mater. 17, 327 (1988).Google Scholar
2. Lum, R.M. and Klingert, J.K., J. Cryst. Growth 89, 137 (1988).Google Scholar
3. Chen, C.H., Larsen, C.A. and Stringfellow, G.B., Appl. Phys. Letters 50,21(1987).Google Scholar
4. Sundaram, V.S., Avery, J.E., Girarad, G.R., Hager, H.E., Thompson, A.G. and Fraas, L.M., Mat. Res. Soc. Symp. Proc. 145, 211 (1989).Google Scholar
5. Lum, R.M., Klingert, J.K., Ren, F. and Shaw, N.J., Appl.Phys. Lett. 56, 379 (1990).Google Scholar
6. Hummel, S.G., Beyler, C.A., Zou, Y., Grodzinski, P. and Dapkus, D.P., Appl. Phys. Letters 56, 695 (1990).Google Scholar
7. Miller, B.I., Young, M.G., Oron, M., Koren, U. and Kisker, D., Appl. Phys. Letters 56, 1439 (1990).Google Scholar
8. Haacke, G., Watkins, S.P. and Burkhard, H., Appl. Phys. Letters 56, 478 (1990).Google Scholar
9. Chao, P.C., Smith, P.M., Palmateer, S.C. and Huang, J.C.M., IEEE Trans. Electron Devices, ED32, 1042 (1985).Google Scholar