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High Cooling Power Density of SiGe/Si Superlattice Microcoolers

Published online by Cambridge University Press:  21 March 2011

Gehong Zeng
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
Xiaofeng Fan
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
Chris LaBounty
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
John E. Bowers
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106
Edward Croke
Affiliation:
HRL Laboratories, LLC, Malibu, California, 90265
James Christofferson
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Daryoosh Vashaee
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Yan Zhang
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Ali Shakouri
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
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Abstract

Fabrication and characterization of SiGe/Si superlattice microcoolers integrated with thin film resistors are described. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Thin film metal resistors were integrated on top of the cooler devices and they were used as heat load for cooling power density measurement. Various device sizes were characterized. Net cooling over 4.1 K and a cooling power density of 598 W/cm2 for 40 × 40 μm2 devices were measured at room temperature.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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