Hostname: page-component-cd9895bd7-q99xh Total loading time: 0 Render date: 2024-12-27T02:06:02.167Z Has data issue: false hasContentIssue false

High Carrier Lifetime Bulk-Grown 4H-SiC Substrates for Power Applications

Published online by Cambridge University Press:  01 February 2011

David Malta
Affiliation:
[email protected], Cree, Inc., Materials, 4600 Silicon Drive, Durham, NC, 27703, United States, 919-313-5481
J.R. Jenny
Affiliation:
[email protected], Cree, Inc., 4600 Silicon Drive, Durham, NC, 27703, United States
V.F. Tsvetkov
Affiliation:
[email protected], Cree, Inc., 4600 Silicon Drive, Durham, NC, 27703, United States
M. Das
Affiliation:
[email protected], Cree, Inc., 4600 Silicon Drive, Durham, NC, 27703, United States
St. G. Müller
Affiliation:
[email protected], Cree, Inc., 4600 Silicon Drive, Durham, NC, 27703, United States
H. McD. Hobgood
Affiliation:
[email protected], Cree, Inc., 4600 Silicon Drive, Durham, NC, 27703, United States
C.H. Carter Jr.
Affiliation:
[email protected], Cree, Inc., 4600 Silicon Drive, Durham, NC, 27703, United States
R.J. Kumar
Affiliation:
[email protected], Rensselaer Polytechnic Institute, 110 8th St., Troy, NY, 12180, United States
J.M. Borrego
Affiliation:
[email protected], Rensselaer Polytechnic Institute, 110 8th St., Troy, NY, 12180, United States
R.J. Gutmann
Affiliation:
[email protected], Rensselaer Polytechnic Institute, 110 8th St., Troy, NY, 12180, United States
Get access

Abstract

A thermal anneal process has been developed that significantly enhances minority carrier lifetime (MCL) in bulk-grown substrates. Microwave photoconductivity decay (MPCD) measurements on bulk grown substrates subjected to this process have exhibited decay times in excess of 35 μs. Electron Beam Induced Current (EBIC) measurements indicated a minority carrier diffusion length (MCDL) of 65 μm resulting in a calculated MCL of 15 μs, well within the range of that measured by MPCD. Deep level transient spectroscopic (DLTS) analysis of samples subjected to this anneal process indicated that a significant reduction of deep level defects, particularly Z1/2, may account for the significantly enhanced lifetimes. The enhanced lifetime is coincident with a transformation of the original as-grown crystal into a strained or disordered lattice configuration as a result of the high temperature anneal process. PiN diodes were fabricated employing 350 μm thick bulk-grown substrates as the intrinsic drift region and thin p- and n-type epitaxial layers on either face of the substrate to act as the anode and cathode, respectively. Conductivity modulation was achieved in these diodes with a 10x effective carrier concentration increase over the background doping as extracted from the differential on-resistance. Significant stacking fault generation observed during forward operation served as additional evidence of conductivity modulation and underscores the importance of reducing dislocation densities in substrates in order to produce a viable bulk-grown drift layer.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Das, M.K., Sumakeris, J.J., Hull, B.A., Richmond, J., Krishnaswami, S., and Powell, A.R., Materials Science Forum 483–485, 965968 (2005)Google Scholar
2 Polyakov, A.Y., Li, Q., Wook Huh, S., Skowronski, M., Lopatiuk, O., Chernyak, L., Sanchez, E., J. Appl. Phys. 97, 053703 (2005)Google Scholar
3 Doolittle, W.A., Rohatghi, A., Ahrienkel, R., Levi, D., Augustine, G., and Hopkins, R.H., Mater. Res. Soc. Symp. Proc. 483, 197 (1998)Google Scholar
4 See for example, Milnes, A.G., “Impurity and Defect Levels in GaAs”, in Advances in Electronics and Electron Physics (Hawkes, P.W., ed.). Academics Press, Orlando, FL 61, 63 (1983)Google Scholar
5 Jenny, J.R., Malta, D.P., Müller, St. G., Powell, A.R., Tsvetkov, V.F., Hobgood, H. McD., Glass, R.C., and Carter, C.H. Jr., J. Electronic Materials, 32, 5 2003 Google Scholar
6 Jenny, J.R, Malta, D.P., Calus, M.R., Müller, St. G., Powell, A.R., Tsvetkov, V.F., Hobgood, H. McD., Glass, R.C., and Carter, C.H. Jr., Mat. Science Forum 457–460, 3540 (2004)Google Scholar
7 Borrego, J.M., Gutmann, R.J., Jensen, N., and Paz, O., Sol. State Elec., 30, 195 (1987)Google Scholar
8 Chernyak, L., Osinsky, A., Temkin, H., Yang, J.W., Chen, Q., and Khan, M. Asif Appl. Phys. Lett., 69, 25312533 (1996)Google Scholar
9 Leamy, H.J., J. Appl. Phys. 53, 6 (1982)Google Scholar
10 Zhang, J., Storasta, L., Bergman, J.P., Son, N.T., and Jansen, E., J. Appl. Phys. 93, 4708 (2003)Google Scholar