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Hardness and Adhesion Measurements of Copper Metallizations by a Continuous Indentation Approach

Published online by Cambridge University Press:  25 February 2011

W.R. Lafontaine  and
Che-Yu Li
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
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Abstract

A continuous indentation test has been used to evaluate the difference in adhesion between copper films deposited on oxidized silicon substrates with different transition metalinterlayers. Variations in adhesion between samples with interlayers of Al,Cr,Ni,Ti and V correlated with the free energy of formation of the particular metal oxide present.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 163
Copyright
Copyright © Materials Research Society 1991

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References

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